Packaging information
| Package | Pins VSSOP (DCU) | 8 |
| Operating temperature range (°C) -40 to 125 |
| Package qty | Carrier 3,000 | LARGE T&R |
Features for the SN74LVC3G34
- Available in the Texas Instruments
NanoFree Package - Supports 5.5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 4.1 ns at 3.3 V
- Low Power Consumption, 10-µA Maximum ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Can Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the VCC Level
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
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Description for the SN74LVC3G34
The SN74LVC3G34 device is a triple buffer gate designed for 1.65-V to 5.5-V VCC operation. The SN74LVC3G34 device performs the Boolean function Y = A in positive logic.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.