Product details

Audio input type Digital Input Architecture Class-D Speaker channels (max) 3 Rating Catalog Power stage supply (max) (V) 26.4 Power stage supply (min) (V) 8 Load (min) (Ω) 4 Output power (W) 50 SNR (dB) 104 THD + N at 1 kHz (%) 0.05 Iq (typ) (mA) 32 Control interface I2C, Software Closed/open loop Open Analog supply (min) (V) 3 Analog supply voltage (max) (V) 3.6 Sampling rate (max) (kHz) 48 Operating temperature range (°C) 0 to 125
Audio input type Digital Input Architecture Class-D Speaker channels (max) 3 Rating Catalog Power stage supply (max) (V) 26.4 Power stage supply (min) (V) 8 Load (min) (Ω) 4 Output power (W) 50 SNR (dB) 104 THD + N at 1 kHz (%) 0.05 Iq (typ) (mA) 32 Control interface I2C, Software Closed/open loop Open Analog supply (min) (V) 3 Analog supply voltage (max) (V) 3.6 Sampling rate (max) (kHz) 48 Operating temperature range (°C) 0 to 125
HTSSOP (DFD) 56 113.4 mm² 14 x 8.1
  • Reduced Sol
    • Single-chip 2.1, 2.0 and Mono Mode Capable
    • Single-filter in Mono (PBTL) Mode.
    • Pad-up Package and 80 mΩ RDSON Enhances Thermal Performance
  • High Output Power capable:
    • 2 × 19 W +1 × 50 W in 2.1 mode
      (2 × 4 Ω + 1 × 6 Ω, 24 V)
    • 2 × 50 W in 2.0 mode (2 × 6 Ω, 24 V)
    • 1 × 100 W in Mono Mode (1 × 2 Ω, 24 V)
    • Wide Voltage Range: 8 V to 26.4 V
  • Audio Performance Audio:
    • THD+N ≤ 0.05% at 1 kHz (RSPK = 8 Ω, POUT = 1 W, PVDD = 18 V)
    • ICN ≤ 50 µVRMS
    • Crosstalk ≤ - 67 dB
    • SNR ≥ 104 dB
    • BD Modulation Available, for Improved Audio Performance and Efficiency.
  • Integrated Audio Processing:
    • 2 × 8 + 1 × 2 Biquads
    • Two-band + Single-band configurable Dynamic Range Control (DRC)
    • License-Free 3D Effects
    • Signal Mixing and DC blocking filter
    • Automatic Rate Detection
  • Integrated Self-protection
    • Thermal Protection
    • Over-current Limit Protection
    • Under-voltage Protection
  • Reduced Sol
    • Single-chip 2.1, 2.0 and Mono Mode Capable
    • Single-filter in Mono (PBTL) Mode.
    • Pad-up Package and 80 mΩ RDSON Enhances Thermal Performance
  • High Output Power capable:
    • 2 × 19 W +1 × 50 W in 2.1 mode
      (2 × 4 Ω + 1 × 6 Ω, 24 V)
    • 2 × 50 W in 2.0 mode (2 × 6 Ω, 24 V)
    • 1 × 100 W in Mono Mode (1 × 2 Ω, 24 V)
    • Wide Voltage Range: 8 V to 26.4 V
  • Audio Performance Audio:
    • THD+N ≤ 0.05% at 1 kHz (RSPK = 8 Ω, POUT = 1 W, PVDD = 18 V)
    • ICN ≤ 50 µVRMS
    • Crosstalk ≤ - 67 dB
    • SNR ≥ 104 dB
    • BD Modulation Available, for Improved Audio Performance and Efficiency.
  • Integrated Audio Processing:
    • 2 × 8 + 1 × 2 Biquads
    • Two-band + Single-band configurable Dynamic Range Control (DRC)
    • License-Free 3D Effects
    • Signal Mixing and DC blocking filter
    • Automatic Rate Detection
  • Integrated Self-protection
    • Thermal Protection
    • Over-current Limit Protection
    • Under-voltage Protection

The TAS5755M is a single-chip flexible digital audio solution with integrated processing that supports 2.1 (2 speakers + subwoofer), 2.0 or stereo (2 speakers) and mono (high power speaker) modes.

Its high efficiency, low 80 mΩ RDSON and pad-up package allows the device to output up to 2 × 50 W or 1 × 100 W.

TAS5755M leverages 2 full H-bridges which are used for each channel in stereo mode. In 2.1 mode, TAS5755M runs 2 independent speaker channels using 2 half-bridges while using a full-bridge to drive a subwoofer. Finally, in mono mode, TAS5755M supports pre-filter parallel bridge tied load (PBTL) using only one filter stage to reduce total system size and cost.

TAS5755M has integrated audio processing. It includes: signal mixing, DC blocking filters, 2 × 8 + 1 × 2 biquads for equalization. Power limiting is implemented by leveraging a two-band log-style DRC and a separate single-band DRC for the subwoofer channel.

The TAS5755M is a single-chip flexible digital audio solution with integrated processing that supports 2.1 (2 speakers + subwoofer), 2.0 or stereo (2 speakers) and mono (high power speaker) modes.

Its high efficiency, low 80 mΩ RDSON and pad-up package allows the device to output up to 2 × 50 W or 1 × 100 W.

TAS5755M leverages 2 full H-bridges which are used for each channel in stereo mode. In 2.1 mode, TAS5755M runs 2 independent speaker channels using 2 half-bridges while using a full-bridge to drive a subwoofer. Finally, in mono mode, TAS5755M supports pre-filter parallel bridge tied load (PBTL) using only one filter stage to reduce total system size and cost.

TAS5755M has integrated audio processing. It includes: signal mixing, DC blocking filters, 2 × 8 + 1 × 2 biquads for equalization. Power limiting is implemented by leveraging a two-band log-style DRC and a separate single-band DRC for the subwoofer channel.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 2
Type Title Date
* Data sheet TAS5755M 2 × 50W (2 × 19W + 1 × 50W) Digital Input Audio Amplifier With Integrated Audio Processor and 2.1 Mode Support datasheet (Rev. C) PDF | HTML 27 Apr 2018
EVM User's guide TAS5755EVM Evaluation Module (Rev. A) 18 Oct 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TAS5755MEVM — TAS5755M Evaluation Module

The TAS5755M evaluation module demonstrates the TAS5755M device from Texas Instruments. The TAS5755M combines a high-performance PWM processor with a class-D audio power amplifier. This EVM can be configured with two single-ended (SE) speakers with a BTL subwoofers (2.1) or two bridge-tied (...)
User guide: PDF
Not available on TI.com
Simulation model

TAS5755M IBIS Model

SLOM436.ZIP (39 KB) - IBIS Model
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins CAD symbols, footprints & 3D models
HTSSOP (DFD) 56 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos