TIBPAL16R4-15M
- High-Performance Operation: Propagation Delay . . . 15 ns Max
- Power-Up Clear on Registered Devices (All Register Outputs are Set High,
but Voltage Levels at the Output Pins Go Low) - Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs
- Dependable Texas Instruments Quality and Reliability
IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.
These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.
The TIBPAL16 M series is characterized for operation over the full military temperature range of 55°C to 125°C.
IMPORTANT PROGAMMING NOTE: For TIBPAL16L8-15M devices in J, W, or FK packages - For date code 9903A or later device programming, select from either TI Military/16L8-12 or TI commercial TI/16L8-10 on the Manufacturer/Device menu listing in your programming system.
IMPORTANT PROGAMMING NOTE: For TIBPAL16R4-15M devices in J, W, or FK packages - For date code 9616A or later device programming, select from either TI Military/16R4-12 or TI commercial TI /16R4-10 on the Manufacturer/Device menu listing in your programming system.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | High-Performance Impact Programmable Array Logic Circuits.. datasheet (Rev. B) | 02 Nov 2011 |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location