Packaging information
| Package | Pins SOIC (D) | 8 |
| Operating temperature range (°C) |
| Package qty | Carrier 75 | TUBE |
Features for the TPA311
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V - 5.5 V
- Output Power for RL = 8
- 350 mW at VDD = 5 V, BTL
- 250 mW at VDD = 5 V, SE
- 250 mW at VDD = 3.3 V, BTL
- 75 mW at VDD = 3.3 V, SE
- Shutdown Control
- IDD = 7 µA at 3.3 V
- IDD = 60 µA at 5 V
- BTL to SE Mode Control
- Integrated Depop Circuitry
- Thermal and Short-Circuit Protection
- Surface Mount Packaging
- SOIC
- PowerPADTM MSOP
PowerPAD is a trademark of Texas Instruments Incorporated.
Description for the TPA311
The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.