UCC2540
High Efficiency Secondary Side Synchronous Buck PWM Controller
UCC2540
- On-Chip Predictive Gate Drive™ for High-Efficiency Synchronous Buck Operation
- Dual ±3-A TrueDrive™ Outputs
- 1-MHz High Frequency Operation with 70-ns Delay from SYNCIN to G1 Output
- Leading Edge Modulation
- Overcurrent Protection using a Parallel Average Current Mode Control Loop
- 3 Modes to Support 2.7-V to 35-V Bias Operation
- Reverse Current Protection for Output Stage
- User Programmable Shutdown
- ±1.0% Initial Tolerance Bandgap Reference
- High Bandwidth Error Amplifiers
- Thermally Enhanced HTSSOP 20-Pin PowerPAD™ Package
- APPLICATIONS
- Secondary-Side Post Regulation (SSPR) for Multiple Output Power Supplies
- Cascaded Buck Converters
- Post Processing Converters for Bus Converter and DC Transformer Architectures
Predictive Gate Drive, TrueDrive, and PowerPAD are a trademarks of Texas Instruments Incorporated.
The UCC2540 is a secondary-side synchronous buck PWM controller for high current and low output voltage applications. It can be used either as the local secondary-side controller for isolated dc-dc converters using two-stage cascaded topologies or as a secondary-side post regulator (SSPR) for multiple output power supplies.
The UCC2540 runs with the synchronization signal from either the primary side or the high duty cycle quasi-dc output of bus converters or dc transformers. For higher efficiency, it also incorporates the Predictive Gate Drive technology that virtually eliminates body diode conduction losses in synchronous rectifiers.
The UCC2540 is available in the extended temperature range of 40°C to 105°C and is offered in thermally enhanced PowerPAD 20-pin HTSSOP (PWP) package. This space saving package with standard 20-pin TSSOP footprint has a drastically lower thermal resistance of 1.4°C/W øJC to accommodate the dual high-current drivers on board.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | High-Efficiency Secondary Side Synchronous PWM Controller datasheet (Rev. C) | 10 Oct 2008 |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location