Product details

Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 5.2 IOH (max) (mA) -5.2 Supply current (max) (µA) 20 Input type TTL-Compatible CMOS Output type 3-State Features Standard speed (tpd > 50ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 5.2 IOH (max) (mA) -5.2 Supply current (max) (µA) 20 Input type TTL-Compatible CMOS Output type 3-State Features Standard speed (tpd > 50ns) Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67
  • LSTTL input logic compatible
    • VIL(max) = 0.8 V, VIH(min) = 2 V
  • CMOS input logic compatible
    • II ≤ 1 µA at VOL, VOH
  • Buffered inputs
  • 4.5 V to 5.5 V operation
  • Wide operating temperature range: -55°C to +125°C
  • Supports fanout up to 10 LSTTL loads
  • Significant power reduction compared to LSTTL logic ICs
  • LSTTL input logic compatible
    • VIL(max) = 0.8 V, VIH(min) = 2 V
  • CMOS input logic compatible
    • II ≤ 1 µA at VOL, VOH
  • Buffered inputs
  • 4.5 V to 5.5 V operation
  • Wide operating temperature range: -55°C to +125°C
  • Supports fanout up to 10 LSTTL loads
  • Significant power reduction compared to LSTTL logic ICs

This device contains six independent inverters. Each gate performs the Boolean function Y =  A in positive logic.

This device contains six independent inverters. Each gate performs the Boolean function Y =  A in positive logic.

Download

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet CD54HCT04, CD74HCT04 High-Speed CMOS Logic Hex Inverter datasheet 29 Aug 2019

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​