Load(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
The SN65LVDS179, SN65LVDS180, SN65LVDS050, and SN65LVDS051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps. The TIA/EIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100- load, and receipt of 100-mV signals with up to 1 V of ground potential difference between a transmitter and receiver.
The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100- characteristic impedance. The transmission media may be printed circuit board traces, backplanes, or cables. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application specific characteristics.)
The devices offer various driver, receiver, and enabling combinations in industry standard footprints. Since these devices are intended for use in simplex or distributed simplex bus structures, the driver enable function does not put the differential outputs into a high-impedance state, but rather disconnects the input and reduces the quiescent power used by the device. (For these functions with a high-impedance driver output, see the SN65LVDM series of devices.) All devices are characterized for operation from -55°C to 125°C.
| Typ | Titel | Datum | ||
|---|---|---|---|---|
| * | Data sheet | SN65LVDS179-EP, SN65LVDS180-EP, SN65LVDS050-EP, SN65LVDS051-EP datasheet (Rev. B) | 16 Jan 2007 | |
| * | Radiation & reliability report | SN65LVDS179MDGKREP Reliability Report | 14 Mär 2018 | |
| * | VID | SN65LVDS179-EP VID V6207612 | 21 Jun 2016 | |
| Application brief | LVDS to Improve EMC in Motor Drives | 27 Sep 2018 | ||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 03 Aug 2018 | ||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 16 Mai 2018 |
Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.
| Gehäuse | Pins | CAD-Symbole, Footprints und 3D-Modelle |
|---|---|---|
| VSSOP (DGK) | 8 | Ultra Librarian |
Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.
Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.
Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support.