I2C インターフェイス付き、540mW、モノラル、35mW ステレオ、アナログ入力 Class-AB オーディオ・アンプ

製品詳細

Rating Catalog Operating temperature range (°C) -40 to 85
Rating Catalog Operating temperature range (°C) -40 to 85
WQFN (RTW) 24 16 mm² 4 x 4

  • I 2 C/SPI Control Interface
  • I 2 C/SPI programmable National 3D Audio
  • I 2 C/SPI controlled 32 step digital volume control (-54dB to +18dB)
  • Three independent volume channels (Left, Right, Mono)
  • Eight distinct output modes
  • LLP and microSMD surface mount packaging
  • “Click and Pop” suppression circuitry
  • Thermal shutdown protection
  • Low shutdown current (0.02uA, typ)
  • RF immunity topology

  • I 2 C/SPI Control Interface
  • I 2 C/SPI programmable National 3D Audio
  • I 2 C/SPI controlled 32 step digital volume control (-54dB to +18dB)
  • Three independent volume channels (Left, Right, Mono)
  • Eight distinct output modes
  • LLP and microSMD surface mount packaging
  • “Click and Pop” suppression circuitry
  • Thermal shutdown protection
  • Low shutdown current (0.02uA, typ)
  • RF immunity topology

  • The LM4946 is an audio power amplifier capable of delivering 540mW of continuous average power into a mono 8Ω bridged-tied load (BTL) with 1% THD+N, 35mW per channel of continuous average power into stereo 32Ω single-ended (SE) loads with 1% THD+N, or an output capacitor-less (OCL) configuration with identical specifications as the SE configuration, from a 3.3V power supply.

    The LM4946 has three input channels: one pair for a two-channel stereo signal and the third for a differential single-channel mono input. The LM4946 features a 32-step digital volume control and eight distinct output modes. The digital volume control, 3D enhancement, and output modes (mono/SE/OCL) are programmed through a two-wire I 2C or a three-wire SPI compatible interface that allows flexibility in routing and mixing audio channels.

    The LM4946 is designed for cellular phone, PDA, and other portable handheld applications. It delivers high quality output power from a surface-mount package and requires only seven external components in the OCL mode (two additional components in SE mode).


    Key Specifications

    THD+N at 1kHz, 540mW into 8Ω BTL (3.3V) 1.0% (typ)
    THD+N at 1kHz, 35mW into 32Ω SE (3.3V) 1.0% (typ)
    Single Supply Operation (VDD) 2.7 to 5.5V
    I 2C/SPI Single Supply Operation  
    LLP 2.2 to 5.5V
    micro SMD 1.7 to 5.5V

    The LM4946 is an audio power amplifier capable of delivering 540mW of continuous average power into a mono 8Ω bridged-tied load (BTL) with 1% THD+N, 35mW per channel of continuous average power into stereo 32Ω single-ended (SE) loads with 1% THD+N, or an output capacitor-less (OCL) configuration with identical specifications as the SE configuration, from a 3.3V power supply.

    The LM4946 has three input channels: one pair for a two-channel stereo signal and the third for a differential single-channel mono input. The LM4946 features a 32-step digital volume control and eight distinct output modes. The digital volume control, 3D enhancement, and output modes (mono/SE/OCL) are programmed through a two-wire I 2C or a three-wire SPI compatible interface that allows flexibility in routing and mixing audio channels.

    The LM4946 is designed for cellular phone, PDA, and other portable handheld applications. It delivers high quality output power from a surface-mount package and requires only seven external components in the OCL mode (two additional components in SE mode).


    Key Specifications

    THD+N at 1kHz, 540mW into 8Ω BTL (3.3V) 1.0% (typ)
    THD+N at 1kHz, 35mW into 32Ω SE (3.3V) 1.0% (typ)
    Single Supply Operation (VDD) 2.7 to 5.5V
    I 2C/SPI Single Supply Operation  
    LLP 2.2 to 5.5V
    micro SMD 1.7 to 5.5V

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    種類 タイトル 最新の英語版をダウンロード 日付
    * データシート LM4946 Output Capacitor-Less Audio Subsystem with Programmable TI 3D データシート (Rev. E) 2007年 8月 1日

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    記載されている情報:
    • RoHS
    • REACH
    • デバイスのマーキング
    • リード端子の仕上げ / ボールの原材料
    • MSL 定格 / ピーク リフロー
    • MTBF/FIT 推定値
    • 使用原材料
    • 認定試験結果
    • 継続的な信頼性モニタ試験結果
    記載されている情報:
    • ファブの拠点
    • 組み立てを実施した拠点

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