SN74LVC574A-Q1
- Qualified for Automotive Applications
- ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) - Operates From 2 V to 3.6 V
- Inputs Accept Voltages to 5.5 V
- Max tpd of 7 ns at 3.3 V
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
- Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
- Ioff Supports Partial-Power-Down Mode Operation
The SN74LVC574A octal edge-triggered D-type flip-flop is designed for 2.7-V to 3.6-V VCC operation.
This device features 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. It is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels at the data (D) inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.
OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of thIs device as a translator in a mixed 3.3-V/5-V system environment.
技術資料
設計および開発
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14-24-LOGIC-EVM — 14 ピンから 24 ピンの D、DB、DGV、DW、DYY、NS、PW の各パッケージに封止した各種ロジック製品向けの汎用評価基板
14-24-LOGIC-EVM 評価基板 (EVM) は、14 ピンから 24 ピンの D、DW、DB、NS、PW、DYY、DGV の各パッケージに封止した各種ロジック デバイスをサポートする設計を採用しています。
パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
---|---|---|
SOIC (DW) | 20 | Ultra Librarian |
TSSOP (PW) | 20 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点