SN74LVCZ240A
- Operates From 2.7 V to 3.6 V
- Inputs Accept Voltages to 5.5 V
- Max tpd of 6.5 ns at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
<2 V at VCC = 3.3 V, TA = 25°C - Ioff and Power-Up 3-State Support Hot Insertion
- Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
This octal buffer/driver is designed for 2.7-V to 3.6-V VCC operation.
The SN74LVCZ240A is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
This device is organized as two 4-bit buffers/drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
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14-24-LOGIC-EVM — 14 ピンから 24 ピンの D、DB、DGV、DW、DYY、NS、PW の各パッケージに封止した各種ロジック製品向けの汎用評価基板
14-24-LOGIC-EVM 評価基板 (EVM) は、14 ピンから 24 ピンの D、DW、DB、NS、PW、DYY、DGV の各パッケージに封止した各種ロジック デバイスをサポートする設計を採用しています。
パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
---|---|---|
SOIC (DW) | 20 | Ultra Librarian |
SOP (NS) | 20 | Ultra Librarian |
TSSOP (PW) | 20 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点