CD54HCT258
- 4.5-V to 5.5-V VCC Operation
- Wide Operating Temperature Range of –55°C to 125°C
- Balanced Propagation Delays and Transition Times
- Standard Outputs Drive Up To 10 LS-TTL Loads
- Significant Power Reduction Compared to LS-TTL Logic ICs
- Inputs Are TTL-Voltage Compatible
These devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (G)\ input is at a high logic level.
To ensure the high-impedance state during power up or power down, G\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
기술 자료
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
13개 모두 보기 유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CD54HCT258, CD74HCT258 datasheet (Rev. A) | 2003/04/18 | |
* | SMD | CD54HCT258 SMD 5962-89708 | 2016/06/21 | |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
User guide | Signal Switch Data Book (Rev. A) | 2003/11/14 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997/06/01 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | SN54/74HCT CMOS Logic Family Applications and Restrictions | 1996/05/01 | ||
Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996/04/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치