CPU Features
- Fully static RISC processor core,
  capable of operating from 0 to 96 MHz
  with zero wait/hold state
- Minimum 10.4 ns instruction cycle time
  with a 96-MHz internal clock frequency,
  based on a 12-MHz external input
- 4K-byte, 4-way set-associative
  instruction cache
- 69 independently vectored peripheral
  interrupts
DSP Features
- Capable of operating up to 96 MHz
- 16-bit fixed-point arithmetic, dual-MAC
  architecture
- 32-bit interface to 4K-byte RAM shared with
  CPU
- 32-bit external bus interface
- Bus master interface to audio peripherals
  and I/O
Memory
- 4K bytes CPU instructioncache
- 32K bytes CPU data RAM
- 4K bytes CPU/DSP shared RAM
- 24K bytes DSP program RAM
- 24K bytes DSP data RAM
- 8K bytes Bluetooth sequencer and data RAM
- Addresses up to 96M bytes (FBGA-224 package)
  or 8M bytes (FBGA-144 package) of external
  memory
Broad Range of Hardware Communications Peripherals
- Bluetooth Lower Link Controller (LLC)
  including a shared 7K byte Bluetooth data
  RAM and 1K byte Bluetooth Sequencer RAM
- Universal Serial Bus (USB) 2.0 On-The-Go
- Audio/telematics codec with dual ADC inputs
  and high quality stereo DAC output
- Two CAN interfaces with 15 message buffers
  conforming to CAN specification 2.0B active
- Two ACCESS.bus serial bus interfaces (I²C compatible)
- Two 8/16-bit SPI, Microwire/Plus serial interfaces
- I²S digital audio bus interface
- Four Universal Asynchronous Receiver/Transmitter (UART)
  channels, one channel has USART capability
- Advanced Audio Interface (AAI) to connect to external
  8/ 13-bit PCM Codecs as well as to ISDN-Controllers
  through the IOM-2 interface (slave only)
- Two CVSD/PCM converters, for supporting two bidirectional
  audio connections
External Bus Interface Shared Between CPU and DSP
- 16/32-bit data busbus interface
- 23-bit address bus
- 3 programmable chip select outputs
- Up to 96M bytes external memory
- 8-level write buffer
General-Purpose Hardware Peripherals
- 10-channel, 10-bit A/D Converter (ADC)
- 16-channel DMA controller
- Dual 16-bit Multi-Function Timer (MFT)
- Dual Versatile Timer Units (VTU), each with four
  independent timers
- Timing and Watchdog Unit
Extensive Power and Clock Management Support
- Two Phase Locked Loops (PLL) for synthesizing independent
  system and audio peripheral clocks
- Two independent oscillators for Active mode
  (12 MHz) and Power Save mode (32.768 kHz) clocks
- Low-power modes (Power Save, Idle, and Halt) for
  slowing or stopping clocks to optimize power
  consumption while meeting application needs
Flexible I/O
- Up to 64 general-purpose I/O pins (shared with on-chip
  peripheral I/O)
- Programmable I/O pin characteristics: TRI-STATE output,
  push-pull output, weak pullup/pulldown input, high
  impedance input, high-speed drive capability
- Schmitt triggers on general-purpose inputs
- Multi-Input Wake-Up (MIWU) capability…
Power Supply
- I/O port operation at 3.0–3.3V
- Core logic operation at 1.8V
- On-chip power-on reset
Temperature Range
- –40°C to +85°C (Industrial)
Packages
- FBGA-224, FBGA-144
Complete Development Environment
- Pre-integrated hardware and software support for
  rapid prototyping and production
- Multi-file C source editor, source debugger,
  and project manager
- Comprehensive, integrated, one-stop technical support
Bluetooth Protocol Stack
- Applications can interface to the high-level
  protocols or directly to the low-level Host
  Controller Interface (HCI)
- Transport layer support allows HCI command-based
  interface over UART port
- Baseband (Link Controller) hardware minimizes
  the bandwidth demand on the CPU
- Link Manager (LM)
- Logical Link Control and Adaptation Protocol
  (L2CAP)
- Service Discovery Protocol (SDP)
- RFCOMM Serial Port Emulation Protocol
- All packet types, piconet, and scatternet
  functionality

CPU Features
- Fully static RISC processor core,
  capable of operating from 0 to 96 MHz
  with zero wait/hold state
- Minimum 10.4 ns instruction cycle time
  with a 96-MHz internal clock frequency,
  based on a 12-MHz external input
- 4K-byte, 4-way set-associative
  instruction cache
- 69 independently vectored peripheral
  interrupts
DSP Features
- Capable of operating up to 96 MHz
- 16-bit fixed-point arithmetic, dual-MAC
  architecture
- 32-bit interface to 4K-byte RAM shared with
  CPU
- 32-bit external bus interface
- Bus master interface to audio peripherals
  and I/O
Memory
- 4K bytes CPU instructioncache
- 32K bytes CPU data RAM
- 4K bytes CPU/DSP shared RAM
- 24K bytes DSP program RAM
- 24K bytes DSP data RAM
- 8K bytes Bluetooth sequencer and data RAM
- Addresses up to 96M bytes (FBGA-224 package)
  or 8M bytes (FBGA-144 package) of external
  memory
Broad Range of Hardware Communications Peripherals
- Bluetooth Lower Link Controller (LLC)
  including a shared 7K byte Bluetooth data
  RAM and 1K byte Bluetooth Sequencer RAM
- Universal Serial Bus (USB) 2.0 On-The-Go
- Audio/telematics codec with dual ADC inputs
  and high quality stereo DAC output
- Two CAN interfaces with 15 message buffers
  conforming to CAN specification 2.0B active
- Two ACCESS.bus serial bus interfaces (I²C compatible)
- Two 8/16-bit SPI, Microwire/Plus serial interfaces
- I²S digital audio bus interface
- Four Universal Asynchronous Receiver/Transmitter (UART)
  channels, one channel has USART capability
- Advanced Audio Interface (AAI) to connect to external
  8/ 13-bit PCM Codecs as well as to ISDN-Controllers
  through the IOM-2 interface (slave only)
- Two CVSD/PCM converters, for supporting two bidirectional
  audio connections
External Bus Interface Shared Between CPU and DSP
- 16/32-bit data busbus interface
- 23-bit address bus
- 3 programmable chip select outputs
- Up to 96M bytes external memory
- 8-level write buffer
General-Purpose Hardware Peripherals
- 10-channel, 10-bit A/D Converter (ADC)
- 16-channel DMA controller
- Dual 16-bit Multi-Function Timer (MFT)
- Dual Versatile Timer Units (VTU), each with four
  independent timers
- Timing and Watchdog Unit
Extensive Power and Clock Management Support
- Two Phase Locked Loops (PLL) for synthesizing independent
  system and audio peripheral clocks
- Two independent oscillators for Active mode
  (12 MHz) and Power Save mode (32.768 kHz) clocks
- Low-power modes (Power Save, Idle, and Halt) for
  slowing or stopping clocks to optimize power
  consumption while meeting application needs
Flexible I/O
- Up to 64 general-purpose I/O pins (shared with on-chip
  peripheral I/O)
- Programmable I/O pin characteristics: TRI-STATE output,
  push-pull output, weak pullup/pulldown input, high
  impedance input, high-speed drive capability
- Schmitt triggers on general-purpose inputs
- Multi-Input Wake-Up (MIWU) capability…
Power Supply
- I/O port operation at 3.0–3.3V
- Core logic operation at 1.8V
- On-chip power-on reset
Temperature Range
- –40°C to +85°C (Industrial)
Packages
- FBGA-224, FBGA-144
Complete Development Environment
- Pre-integrated hardware and software support for
  rapid prototyping and production
- Multi-file C source editor, source debugger,
  and project manager
- Comprehensive, integrated, one-stop technical support
Bluetooth Protocol Stack
- Applications can interface to the high-level
  protocols or directly to the low-level Host
  Controller Interface (HCI)
- Transport layer support allows HCI command-based
  interface over UART port
- Baseband (Link Controller) hardware minimizes
  the bandwidth demand on the CPU
- Link Manager (LM)
- Logical Link Control and Adaptation Protocol
  (L2CAP)
- Service Discovery Protocol (SDP)
- RFCOMM Serial Port Emulation Protocol
- All packet types, piconet, and scatternet
  functionality

The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.

National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples.

The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.

National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples.

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*	Data sheet	CP3SP33 Processor w Cache, DSP,Bluetooth, USB, Dual CAN Interface datasheet		2013/04/17

CP3SP33

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