THS4513-SP
- Fully Differential Architecture
- Centered Input Common-Mode Range
- Minimum Gain of 2V/V (6 dB)
- Bandwidth: 1100 MHz (Gain = 6 dB)
- Slew Rate: 5100 V/µs
- 1% Settling Time: 5.5 ns
- HD2: -76 dBc at 70 MHz
- HD3: -88 dBc at 70 MHz
- OIP2: 84 dBm at 70 MHz
- OIP3: 42 dBm at 70 MHz
- Input Voltage Noise: 2.2 nV/
Hz (f >10 MHz)
- Noise Figure: 19.8 dB
- Output Common-Mode Control
- Power Supply:
- Voltage: 3 V (±1.5 V) to 5 V (±2.5 V)
- Current: 37.7 mA
- Power-Down Capability: 0.65 mA
- Rad-Tolerant: 150 kRad (Si) TID
- QML-V Qualified, SMD 5962-07223
- APPLICATIONS
- 5 V Data-Acquisition Systems
- High-Linearity ADC Amplifier
- Wireless Communication
- Medical Imaging
- Test and Measurement
The THS4513 is a wideband, fully differential op amp designed for 3.3 V to 5 V data-acquisition systems. It has very low noise at 2.2 nV/ load. Slew rate is very high at 5100 V/µs and with settling time of 5.5 ns to 1% (2 V step), it is ideal for pulsed applications. It is suitable for minimum gain of 6 dB.
To allow for dc coupling to ADCs, its unique output common-mode control circuit maintains the output common-mode voltage within 5 mV offset (typ) from the set voltage, when set within 0.5 V of mid-supply, with less than 4 mV differential offset voltage. The common-mode set point is set to mid-supply by internal circuitry, which may be over-driven from an external source.
The input and output are optimized for best performance with their common-mode voltages set to mid-supply. Along with high performance at low power supply voltage, this makes for extremely high performance single supply 5 V data acquisition systems.
The THS4513 is offered in a 16-pin ceramic flatpack package (W), and is characterized for operation over the full military temperature range from -55°C to 125°C.
기술 자료
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THS4513EVM — THS4513 평가 모듈
THS4513EVM is an evaluation Module for the RGT (16 pin leadless QFN) package.
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TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CFP (HKT) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치