PGA450-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
- Dual NMOS Low-Side Drivers
- Configurable Burst Generator
- Low-Noise Amplifier
- 12-Bit SAR ADC
- Configurable Digital Bandpass Filter
- Digital Signal Envelope Detect
- On-Chip 8-Bit Microprocessor
- LIN 2.1 Physical Interface and Protocol
- Watchdog Timer
- Four-Wire SPI for Testability and Programming
- 8K Bytes of OTP
- 768 Bytes of FIFO RAM
- 256 Bytes of Scratchpad RAM
- 8K Bytes of Development RAM
- 32 Bytes of EEPROM for Application
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The PGA450-Q1 device is a fully integrated system-on-a-chip analog front-end for ultrasonic sensing in automotive park-assist, object-detection through air, level sensing in large tanks, and distance measurements for anti-collision and landing assist of unmanned systems (such as drones, cameras, and robots). This highly integrated device enables a small form-factor and cost-optimized solution compared to discrete ultrasonic-sensor solutions. The PGA450-Q1 device can measure distances ranging from less than 1 meter up to 7 meters, at a resolution of 1 cm depending on the transducer-transformer sensor pair used in the system.
The PGA450-Q1 device has an integrated 8051 8-bit microcontroller and OTP memory for program storage to process the echo signal and calculate the distance between the transducer and targeted object. Full programmability is available for optimization of specific end applications, and to accommodate a wide-range of closed-top or open-top transducers. Configurable variables include the number of transmit pulses, driving frequency, LNA gain, and comparison signal thresholds. External communication with the PGA450-Q1 device is capable through the LIN 2.1 protocol, SPI, or UART interfaces.
For all available packages, see the orderable addendum at the end of the data sheet.Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
PGA450Q1EVM — PGA450Q1EVM - Ultrasonic IC Sensor Signal Conditioner Evaluation Module
This evaluation module features a PGA450-Q1 device which is a system on Chip (SOC) sensor interface IC for automotive ultrasonic sensors. It provides all signal conditioning and processing for the transducer echo signals and for calculating the distance between the transducer and objects. MCU and (...)
SLDC008 — PGA450Q1EVM GUI v1.50.3
Supported products & hardware
Products
Ultrasonic sensor AFEs
Hardware development
Evaluation board
TIDA-00151 — Automotive Ultrasonic Sensor Interface IC for Park Assist or Blind Spot Detection Systems
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
TSSOP (PW) | 28 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
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