Home Logic & voltage translation Buffers, drivers & transceiver Inverting buffers & drivers
Home
Logic & voltage translation
Buffers, drivers & transceiver
Inverting buffers & drivers

SN54LS04-SP

ACTIVE

Space 6-ch, 4.5-V to 5.5-V bipolar inverters

Order now
Data sheet

SN54LS04-SP

ACTIVE
Data sheet Order now

Product details

Technology family LS Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 8 IOH (max) (mA) -0.4 Supply current (max) (µA) 6600 Input type Bipolar Output type Push-Pull Features High speed (tpd 10-50ns) Rating Space Operating temperature range (°C) -55 to 125
Technology family LS Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 8 IOH (max) (mA) -0.4 Supply current (max) (µA) 6600 Input type Bipolar Output type Push-Pull Features High speed (tpd 10-50ns) Rating Space Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67
  • Dependable Texas Instruments Quality and Reliability
  • Dependable Texas Instruments Quality and Reliability

These devices contain six independent inverters.

These devices contain six independent inverters.
filter Find other Inverting buffers & drivers
Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 15
Type Title Date
* Data sheet Hex Inverters datasheet (Rev. C) 27 Jan 2004
Application brief DLA Approved Optimizations for QML Products (Rev. B) PDF | HTML 17 May 2024
Selection guide TI Space Products (Rev. J) 12 Feb 2024
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 31 Aug 2023
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) PDF | HTML 17 Nov 2022
Application note Single-Event Effects Confidence Interval Calculations (Rev. A) PDF | HTML 19 Oct 2022
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Designing with the SN54/74LS123 (Rev. A) 01 Mar 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins CAD symbols, footprints & 3D models
CDIP (J) 14 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos