Product details

Technology family S Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -55 to 125 Rating Military
Technology family S Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 16 135.3552 mm² 19.56 x 6.92 CFP (W) 16 69.319 mm² 10.3 x 6.73 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Buffered Inputs and Outputs
  • Three Speed/Power Ranges Available
  • Applications
    • Expand Any Data Input Point
    • Multiplex Dual Data Buses
    • Generate Four Functions of Two Variables (One Variable Is Common)
    • Source Programmable Counters

  • Buffered Inputs and Outputs
  • Three Speed/Power Ranges Available
  • Applications
    • Expand Any Data Input Point
    • Multiplex Dual Data Buses
    • Generate Four Functions of Two Variables (One Variable Is Common)
    • Source Programmable Counters

These monolithic data selectors/multiplexers contain inverters and drivers to supply full on-chip data selection to the four output gates. A separate strobe input is provided. A 4-bit word is selected from one of two sources and is routed to the four outputs. The ’157, ’LS157, and ’S157 present true data whereas the ’LS158 and ’S158 present inverted data to minimize propagation delay time.

These monolithic data selectors/multiplexers contain inverters and drivers to supply full on-chip data selection to the four output gates. A separate strobe input is provided. A 4-bit word is selected from one of two sources and is routed to the four outputs. The ’157, ’LS157, and ’S157 present true data whereas the ’LS158 and ’S158 present inverted data to minimize propagation delay time.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 8
Type Title Date
* Data sheet SN54157, SN54LS157, SN54LS158, SN54S157, SN54S158, SN74157, SN74LS157, SN74LS158 datasheet (Rev. A) 01 Mar 1974
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins CAD symbols, footprints & 3D models
CDIP (J) 16 Ultra Librarian
CFP (W) 16 Ultra Librarian
LCCC (FK) 20 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos