SN74AHC00-EP

ACTIVE

Product details

Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 50 IOH (max) (mA) -50 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 110 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 50 IOH (max) (mA) -50 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 110 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification Qualification Pedigree
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process

EPIC is a trademark of Texas Instruments.
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification Qualification Pedigree
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process

EPIC is a trademark of Texas Instruments.
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.

The SN74AHC00 performs the Boolean function Y = (A • B)\ or Y = A\ + B\ in positive logic.

The SN74AHC00 performs the Boolean function Y = (A • B)\ or Y = A\ + B\ in positive logic.

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Technical documentation

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Type Title Date
* Data sheet Quadruple 2-Input Positive-NAND Gate datasheet 23 Jul 2002
* Radiation & reliability report SN74AHC00MDREP Reliability Report 09 Aug 2016
* VID SN74AHC00-EP VID V6203604 21 Jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 02 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 24 Feb 2000
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 08 Sep 1999
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 01 Apr 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins CAD symbols, footprints & 3D models
SOIC (D) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian

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  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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