Product details

Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 8 Supply current (max) (µA) 40 IOH (max) (mA) -8 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 8 Supply current (max) (µA) 40 IOH (max) (mA) -8 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Operating range 2V to 5.5V VCC
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • Operating range 2V to 5.5V VCC
  • Latch-up performance exceeds 100 mA per JESD 78, class II

The ’AHC367 devices are hex buffers and line drivers designed for 2V to 5.5V VCC operation.

The ’AHC367 devices are hex buffers and line drivers designed for 2V to 5.5V VCC operation.

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Technical documentation

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Type Title Date
* Data sheet SN74AHC367 Hex Buffers and Line Drivers With 3-State Outputs datasheet (Rev. G) PDF | HTML 12 Jul 2024
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 02 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 24 Feb 2000
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 08 Sep 1999
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 01 Apr 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Simulation model

SN74AHC367 Behavioral SPICE Model

SCLM263.ZIP (7 KB) - PSpice Model
Reference designs

TIDA-010023 — Cost optimized, < 1% accurate current sensing and protection for 3-phase inverter reference design

This reference design demonstrates a cost optimized three-phase inverter leg (low-side shunt) current sensing solution with high accuracy and faster response for sensorless 2-shunt or 3-shunt field oriented control (FOC). This reference design demonstrates inverter leg current sensing with full (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
PDIP (N) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian

Ordering & quality

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  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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