SN74AHCT32-EP

ACTIVE

Product details

Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 8 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 70 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 8 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 70 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 1000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

EPIC is a trademark of Texas Instruments.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 1000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

EPIC is a trademark of Texas Instruments.

The SN74AHCT32 is a quadruple 2-input positive-OR gate. This device performs the Boolean function Y = (A\ • B\)\ or Y = A + B in positive logic.

The SN74AHCT32 is a quadruple 2-input positive-OR gate. This device performs the Boolean function Y = (A\ • B\)\ or Y = A + B in positive logic.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Same functionality with different pin-out to the compared device
SN74LV4T32-EP ACTIVE Enhanced-product four-channel two-input OR gate with integrated level shifter Voltage range (1.65V to 5.5V), voltage translation capable

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 20
Type Title Date
* Data sheet SN74AHCT32-EP datasheet 02 May 2003
* VID SN74AHCT32-EP VID V6203658 21 Jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 02 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 24 Feb 2000
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 01 Apr 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins CAD symbols, footprints & 3D models
SOIC (D) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos