BUF06703
- Gamma Correction Channels: 6, 4
- Integrated VCOM Buffer
- Excellent Output Current Drive:
- Gamma Channels: > 10mA
- VCOM: > 100mA typ
- Large Capacitive Load Drive Capability
- Rail-to-Rail Output
- PowerPAD™ Package: BUF07703
- Low-Power/Channel: < 250µA
- Wide Supply Range: 4.5V to 16V
- Specified for –40°C to 85°C
- High ESD Rating: 4kV HBM, 1.5kV CDM
- APPLICATIONS
- LCD Flat Panel Displays
- LCD Television Displays
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
The BUFxx703 are a series of multi-channel buffers targeted towards gamma correction in high-resolution liquid crystal display (LCD) panels. The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, various channel options are offered. For additional space and cost savings, a VCOM channel with higher current drive capability is integrated in the BUF07703 and BUF05703.
A flow-through pinout has been adopted to allow simple printed circuit board (PCB) routing and maintain the cost-effectiveness of this solution. All inputs and outputs of the BUFxx703 incorporate internal ESD protection circuits that prevent functional failures at voltages up to 4kV HBM and 1.5kV CDM.
The various buffers within the BUFxx703 are carefully matched to the voltage I/O requirements for the gamma correction application. Each buffer is capable of driving heavy capacitive loads and offers fast load current switching. The VCOM channel has increased output drive of > 100mA and can handle even larger capacitive loads.
The BUF07703 is available in the HTSSOP PowerPAD™ package for dramatically increased power dissipation capability. The BUF06703 and BUF05703 are available in standard TSSOP-16 and TSSOP-14 packages.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Multi-Channel LCD Gamma Correction Buffer datasheet (Rev. C) | 2010年 4月 21日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點