63-pin (MOB) package image

CC3135MODRNMMOBR 現行

SimpleLink™ 32 位元 ARM Cortex-M3 雙頻 Wi-Fi® 無線網路處理器模組

定價

數量 價格
+

品質資訊

等級 Catalog
RoHS
REACH 受影響
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:5A992C

封裝資訊

封裝 | 針腳 QFM (MOB) | 63
操作溫度範圍 (°C) -40 to 85
包裝數量 | 運送業者 750 | LARGE T&R

CC3135MOD 的特色

  • Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives
  • Integrated Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4GHz and 5GHz
  • FCC, IC/ISED, ETSI/CE, and MIC certified
  • FIPS 140-2 Level 1 validated IC inside
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4GHz radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11 a/b/g/n 2.4GHz and 5GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct (only supported on 2.4GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always on, intermittently connected, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Application throughput
    • UDP: 16Mbps
    • TCP: 13Mbps
  • Multilayered Security Features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • File system security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Recovery mechanism – ability to recover to factory defaults
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3V to 3.6V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5µA
      • Low-power deep sleep (LPDS): 115µA
      • Idle connected (MCU in LPDS): 710µA
      • RX traffic (MCU active): 53mA
      • TX traffic (MCU active): 223mA
  • Wi-Fi TX power
    • 2.4GHz: 16dBm at 1 DSSS
    • 5GHz: 15.1dBm at 6 OFDM
  • Wi-Fi RX sensitivity
    • 2.4GHz: –94.5dBm at 1 DSSS
    • 5GHz: –89dBm at 6 OFDM
  • Additional integrated components on module
    • 40.0MHz crystal with internal oscillator
    • 32.768kHz crystal (RTC)
    • 32Mbit SPI Serial Flash
    • RF filters, diplexer, and passive components
  • QFM package
    • 1.27mm pitch, 63-pin, 20.5mm × 17.5mm QFM package for easy assembly and low-cost PCB design
  • Module supports SimpleLink Developers Ecosystem

CC3135MOD 的說明

The CC3135MOD is an FCC, IC/ISED, ETSI/CE, MIC, and Wi-Fi CERTIFIED™ module that dramatically simplifies the implementation of Internet connectivity. This dual-band Wi-Fi network processor module can be added to any low-cost, low-power microcontroller unit (MCU); it integrates all protocols for Wi-Fi® and Internet, which greatly minimize host MCU software requirements.

This ROM-based subsystem includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptographic engine. With built-in security protocols, the CC3135MOD solution provides a robust and simple security experience. The CC3135MOD is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filters, diplexer, crystal, and passive components that are fully integrated.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features of CC3135MOD include:

  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz support
  • 2.4 GHz Coexistence with Bluetooth low energy radio
  • Antenna diversity
  • Enhanced security with FIPS 140-2 level 1 validated IC inside: certification
  • More concurrent secure sockets, up to 16
  • Unique device identifier with ability to generate certificate signing request (CSR)
  • Online certificate status protocol (OCSP)
  • Wi-Fi Alliance certified for IoT low power capabilities
  • Hostless mode for offloading template packet transmissions
  • Improved fast scan

The CC3135MOD device is part of the SimpleLink™ MCU platform—a common, easy-to-use development environment based on a single-core software development kit (SDK) with a rich tool set and reference designs. The E2E™ community supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/SimpleLink.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解