產品詳細資料

Technology family CD4000 Number of channels 4 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Inputs per channel 2 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Output type Push-Pull Input type Standard CMOS Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
Technology family CD4000 Number of channels 4 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Inputs per channel 2 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Output type Push-Pull Input type Standard CMOS Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6 SOP (NS) 14 79.56 mm² 10.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Propagation delay time = 60 ns (typ.) at CL = 50 pF, VDD = 10 V
  • Buffered inputs and outputs
  • Standardized symmetrical output characteristics
  • 100% tested for maximum quiescent current at 20 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (over full package temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

  • Propagation delay time = 60 ns (typ.) at CL = 50 pF, VDD = 10 V
  • Buffered inputs and outputs
  • Standardized symmetrical output characteristics
  • 100% tested for maximum quiescent current at 20 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (over full package temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

CD4001B, CD4002B, and CD4025B NOR gates provide the system designer with direct implementation of the NOR function and supplement the existing family of CMOS gates. All inputs and outputs are buffered.

The CD4001B, CD4002B, and CD4025B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4001B, CD4002B, and CD4025B NOR gates provide the system designer with direct implementation of the NOR function and supplement the existing family of CMOS gates. All inputs and outputs are buffered.

The CD4001B, CD4002B, and CD4025B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

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類型 標題 日期
* Data sheet CD4001B, CD4002B, CD4025B Types datasheet (Rev. C) 2003年 8月 21日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
User guide Signal Switch Data Book (Rev. A) 2003年 11月 14日
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001年 12月 3日

設計與開發

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開發板

14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組

14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。

使用指南: PDF | HTML
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模擬型號

CD4001B PSPICE Model (Rev. A)

SCHM025A.ZIP (7 KB) - PSpice Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
PDIP (N) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian
SOP (NS) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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