產品詳細資料

Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 2 Inputs per channel 2 IOL (max) (mA) 89 IOH (max) (mA) 0 Input type Standard CMOS Output type Open-drain Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 2 Inputs per channel 2 IOL (max) (mA) 89 IOH (max) (mA) 0 Input type Standard CMOS Output type Open-drain Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
PDIP (P) 8 92.5083 mm² 9.81 x 9.43 SOIC (D) 8 29.4 mm² 4.9 x 6 SOP (PS) 8 48.36 mm² 6.2 x 7.8 TSSOP (PW) 8 19.2 mm² 3 x 6.4
  • 32 times standard B-Series output current drive sinking capability - 136 mA typ. @ VDD = 10 V, VDS = 1 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V parametric ratings
  • Noise margin, full package temperature range, RL to VDD = 10 k:
       1 V at VDD = 5 V
       2 V at VDD = 10 V
       2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications
    • Driving relays, lamps, LEDs
    • Line driver
    • Level shifter (up or down)
  • 32 times standard B-Series output current drive sinking capability - 136 mA typ. @ VDD = 10 V, VDS = 1 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V parametric ratings
  • Noise margin, full package temperature range, RL to VDD = 10 k:
       1 V at VDD = 5 V
       2 V at VDD = 10 V
       2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications
    • Driving relays, lamps, LEDs
    • Line driver
    • Level shifter (up or down)

The CD40107B is a dual 2-input NAND buffer/driver containing two independent 2-input NAND buffers with open-drain single n-channel transistor outputs. This device features a wired-OR capability and high output sink current capability (136 mA typ. at VDD = 10 V, VDS= 1 V). The CD40107B is supplied in 8-lead hermetic dual-in-line ceramic packages (F3A suffix), 8-lead dual-in-line plastic packages (E suffix), 8-lead small-outline packages (M, M96, MT, and PSR suffixes), and 8-lead thin shrink small-outline packages (PW and PWR suffixes).

The CD40107B is a dual 2-input NAND buffer/driver containing two independent 2-input NAND buffers with open-drain single n-channel transistor outputs. This device features a wired-OR capability and high output sink current capability (136 mA typ. at VDD = 10 V, VDS= 1 V). The CD40107B is supplied in 8-lead hermetic dual-in-line ceramic packages (F3A suffix), 8-lead dual-in-line plastic packages (E suffix), 8-lead small-outline packages (M, M96, MT, and PSR suffixes), and 8-lead thin shrink small-outline packages (PW and PWR suffixes).

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類型 標題 日期
* Data sheet CD40107B TYPES datasheet (Rev. D) 2003年 10月 13日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
User guide Signal Switch Data Book (Rev. A) 2003年 11月 14日
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001年 12月 3日

設計與開發

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模擬型號

CD40107B PSPICE Model (Rev. A)

SCHM030A.ZIP (7 KB) - PSpice Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
PDIP (P) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian
SOP (PS) 8 Ultra Librarian
TSSOP (PW) 8 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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