DAC811
- SINGLE INTEGRATED CIRCUIT CHIP
- MICROCOMPUTER INTERFACE: DOUBLE-BUFFERED LATCH
- VOLTAGE OUTPUT: ±10V, ±5V, +10V
- MONOTONICITY GUARANTEED OVER TEMPERATURE
- ±1/2LSB MAXIMUM NONLINEARITY OVER TEMPERATURE
- GUARANTEED SPECIFICATIONS AT ±12V AND ±15V SUPPLIES
- TTL/5V CMOS-COMPATIBLE LOGIC INPUTS
The DAC811 is a complete, single-chip integrated-circuit, microprocessor-compatible, 12-bit digital-to-analog converter. The chip combines a precision voltage reference, microcomputer interface logic, and double-buffered latch, in a 12-bit D/A converter with a voltage output amplifier. Fast current switches and a laser-trimmed thin-film resistor network provide a highly accurate and fast D/A converter.
Microcomputer interfacing is facilitated by a double-buffered latch. The input latch is divided into three 4-bit nibbles to permit interfacing to 4-, 8-, 12-, or 16-bit buses and to handle right-or left-justified data. The 12-bit data in the input latches is transferred to the D/A latch to hold the output value.
Input gating logic is designed so that loading the last nibble or byte of data can be accomplished simultaneously with the transfer of data (previously stored in adjacent latches) from adjacent input latches to the D/A latch. This feature avoids spurious analog output values while using an interface technique that saves computer instructions.
The DAC811 is laser trimmed at the wafer level and is specified to ±1/4LSB maximum linearity error (B, K, and S grades) at 25°C and °1/2LSB maximum over the temperature range. All grades are guaranteed monotonic over the specification temperature range.
The DAC811 is available in six performance grades and three package types. DAC811J and K are specified over the temperature ranges of 0°C to +70°C; DAC811A and B are specified over 25°C to +85°C; DAC811R and S are specified over 55°C to +125°C. DAC811J and K are packaged in a reliable 28-pin plastic DIP or plastic SO package, while DAC811A and B are available in a 28-pin 0.6" wide dual-inline hermetically sealed ceramic side-brazed package (H package).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Microprocessor-Compatible 12-Bit Digital-to-Analog Converter datasheet | 2000年 9月 27日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
ANALOG-ENGINEER-CALC — 類比工程師計算機
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CDIP_SB (JD) | 28 | Ultra Librarian |
SOIC (DW) | 28 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點