DDC316
- SINGLE-CHIP SOLUTION TO MEASURE 16 LOW-LEVEL CURRENTS
- INTEGRATING I-TO-V CONVERSION FRONT-END
- PROGRAMMABLE FULL-SCALE : 3pC to 12pC
- ADJUSTABLE SPEED:
- Data Rate Up To 100kSPS
- Integration Time Down To 10µs
- ANALOG SUPPLY: +5V
- DIGITAL SUPPLY: +3.3V
- APPLICATIONS
- CT SCANNER DAS
- PHOTODIODE SENSORS
- X-RAY DETECTION SYSTEMS
Protected by US Patent #5841310
All trademarks are the property of their respective owners.
The DDC316 is a 16-bit, 16-channel, current-input analog-to-digital converter (ADC). It combines both current-to-voltage and analog-to-digital (A/D) conversion so that 16 separate low-level current output devices (such as photodiodes) can be directly connected to its inputs and digitized.
For each of the 16 inputs, the DDC316 provides a dual-switched integrator front-end. This configuration allows for continuous current integration: while one integrator is being digitized by the on-chip ADC, the other is integrating the input current. Adjustable integration times range from 10µs to 1ms.
The DDC316 provides a serial interface of the output data, either multiplexed onto a single data output pin or parallel on four output pins. The output mode can be selected based on the available integration time.
The DDC316 uses a +5V analog supply and a +3.3V digital supply. Operating over the temperature range of 0°C to +70°C, the DDC316 is offered in a BGA-64 package.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | 16-Channel, Current-Input Analog-to-Digital Converter datasheet (Rev. A) | 2009年 4月 1日 | |
| White paper | Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) | PDF | HTML | 2024年 4月 30日 | |
| Analog Design Journal | Selecting a multichannel ultra-low-current measurement IC | PDF | HTML | 2022年 3月 18日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| NFBGA (GXG) | 64 | Ultra Librarian |
| NFBGA (ZXG) | 64 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點