DS90CR285
- Single +3.3V Supply
- Chipset (Tx + Rx) Power Consumption <250 mW (typ)
- Power-Down Mode (<0.5 mW total)
- Up to 231 Megabytes/sec Bandwidth
- Up to 1.848 Gbps Data Throughput
- Narrow Bus Reduces Cable Size
- 290 mV Swing LVDS Devices for Low EMI
- +1V Common Mode Range (Around +1.2V)
- PLL Requires no External Components
- Both Devices are Offered in a Low Profile 56-Lead TSSOP Package
- Rising Edge Data Strobe
- Compatible with TIA/EIA-644 LVDS Standard
- ESD Rating > 7 kV
- Operating Temperature: −40°C to +85°C
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The DS90CR285 transmitter converts 28 bits of LVCMOS/LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CR286 receiver converts the LVDS data streams back into 28 bits of LVCMOS/LVTTL data. At a transmit clock frequency of 66 MHz, 28 bits of TTL data are transmitted at a rate of 462 Mbps per LVDS data channel. Using a 66 MHz clock, the data throughput is 1.848 Gbit/s (231 Mbytes/s).
The multiplexing of the data lines provides a substantial cable reduction. Long distance parallel single-ended buses typically require a ground wire per active signal (and have very limited noise rejection capability). Thus, for a 28-bit wide data and one clock, up to 58 conductors are required. With the Channel Link chipset as few as 11 conductors (4 data pairs, 1 clock pair and a minimum of one ground) are needed. This provides a 80% reduction in required cable width, which provides a system cost savings, reduces connector physical size and cost, and reduces shielding requirements due to the cables' smaller form factor.
The 28 LVCMOS/LVTTL inputs can support a variety of signal combinations. For example, seven 4-bit nibbles or three 9-bit (byte + parity) and 1 control.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90CR285/DS90CR286 3.3V Rising Edge Data Strobe LVDS 28Bit Channel Link- 66MHz datasheet (Rev. C) | 2013年 3月 5日 | |
Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018年 11月 9日 | ||
Application note | AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (Rev. A) | 2018年 8月 3日 | ||
EVM User's guide | DS90CR285-86ATQEVM User's Guide | 2016年 8月 22日 | ||
Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016年 1月 13日 | ||
Application note | Improving the Robustness of Channel Link Designs with Channel Link II Ser/Des (Rev. A) | 2013年 4月 26日 | ||
Design guide | Channel Link I Design Guide | 2007年 3月 29日 | ||
Application note | Multi-Drop Channel-Link Operation | 2004年 10月 4日 | ||
Application note | CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications | 1998年 10月 5日 |
設計與開發
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DS90CR285-86ATQEVM — DS90CR285 和 DS90CR286AT-Q1 通道連結 I SerDes 評估模組
FLINK3V8BT-85 — 適用於 FPD-Link 系列之串聯器和解串器 LVDS 產品的評估套件
The FPD-Link evaluation kit includes a transmitter (Tx) board, a receiver (Rx) board and interfacing cables. This kit shows the chipsets interfacing from test equipment or a graphics controller using low-voltage differential signaling (LVDS) to a receiver board.
The transmitter board accepts (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (DGG) | 56 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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