DS91C180
- DC to 100+ MHz / 200+ Mbps Low Power, Low EMI Operation
- Optimal for ATCA, uTCA Clock Distribution Networks
- Meets or Exceeds TIA/EIA-899 M-LVDS Standard
- Wide Input Common Mode Voltage for Increased Noise Immunity
- DS91D180 has Type 1 Receiver Input
- DS91C180 has Type 2 Receiver Input for Fail-Safe Functionality
- Industrial Temperature Range
- Space Saving SOIC-14 Package (JEDEC MS-012)
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The DS91D180 and DS91C180 are 100 MHz M-LVDS (Multipoint Low Voltage Differential Signaling) line driver/receiver pairs designed for applications that utilize multipoint networks (e.g. clock distribution in ATCA and uTCA based systems). M-LVDS is a bus interface standard (TIA/EIA-899) optimized for multidrop networks. Controlled edge rates, tight input receiver thresholds and increased drive strength are sone of the key enhancments that make M-LVDS devices an ideal choice for distributing signals via multipoint networks.
The DS91D180/DS91C180 driver input accepts LVTTL/LVCMOS signals and converts them to differential M-LVDS signal levels. The DS91D180/DS91C180 receiver accepts low voltage differential signals (LVDS, B-LVDS, M-LVDS, LV-PECL and CML) and converts them to 3V LVCMOS signals. The DS91D180 device has a M-LVDS type 1 receiver input with no offset.The DS91C180 device has a type 2 receiver input which enable failsafe functionality.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS91D180/DS91C180 100 MHz M-LVDS Line Driver/Receiver Pair datasheet (Rev. M) | 2013年 4月 18日 | |
Application brief | How Far, How Fast Can You Operate MLVDS? | 2018年 8月 6日 | ||
Application note | Designing an ATCA Compliant M-LVDS Clock Distribution Network (Rev. B) | 2013年 4月 26日 | ||
Application note | Introduction to M-LVDS (TIA/EIA-899) (Rev. A) | 2013年 1月 3日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點