HD3SS214
- Compatible with DisplayPort 1.4 electrical standard
- 2:1 and 1:2 switching supporting data rates up to 8.1 Gbps
- Supports HPD, AUX and DDC switching
- Wide differential BW of 8 GHz
- Excellent dynamic electrical characteristics
- VDD operating range 3.3 V ±10%
- Extended industrial temperature range of -40°C to 105°C
- 5 mm x 5 mm, 50-ball nFBGA package
- Output enable (OE) pin disables switch to save power
- Power consumption
- Active < 2 mW typical
- Standby < 10 µW typical (when OE = L)
HD3SS214 is a high-speed passive switch capable of switching two full DisplayPort 4 lane ports from one of two sources to one target location in an application. It will also switch one source to one of two sinks. For DisplayPort Applications, the HD3SS214 supports switching of the Auxiliary (AUX), Display Data Channel (DDC) and Hot Plug Detect (HPD) signals in the nFBGA ZXH package.
One typical application would be a mother board that includes two GPUs that need to drive one DisplayPort sink. The GPU is selected by the Dx_SEL pin. Another application is when one source needs to switch between one of two sinks, example would be a side connector and a docking station connector. The switching is controlled using the Dx_SEL and AUX_SEL pins. The HD3SS214 operates from a single supply voltage of 3.3 V over extended industrial temperature range -40°C to 105°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | HD3SS214 8.1 Gbps DisplayPort 1.4 2:1/1:2 Differential Switch datasheet (Rev. C) | PDF | HTML | 2020年 12月 6日 |
* | User guide | HSSC MicroStar BGA Discontinued and Redesigned | 2022年 5月 8日 | |
Application note | Passive Mux Selection Based On Bandwidth (Rev. A) | PDF | HTML | 2024年 7月 31日 | |
Application note | High-Speed Layout Guidelines for Signal Conditioners and USB Hubs | 2018年 6月 14日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
NFBGA (ZXH) | 50 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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