LM239A
- NEW LM339B and LM2901B
- Improved specifications of B-version
- Maximum rating: up to 38 V
- ESD rating (HBM): 2k V
- Low input offset: 0.37 mV
- Low input bias current: 3.5 nA
- Low supply-current: 200 µA per comparator
- Faster response time of 1 µsec
- Extended temperature range for LM339B
- B-version is drop-in replacement for LM239, LM339 and LM2901, A and V versions
- Common-mode input voltage range includes ground
- Differential input voltage range equal to maximum-rated supply voltage: ±38 V
- Low output saturation voltage
- Output compatible with TTL, MOS, and CMOS
- For single version, see the TL331B
- For dual version, see the LM393B or LM2903B
The LM339B and LM2901B devices are the next generation versions of the industry-standard LM339 and LM2901 comparator family. These next generation B-version comparators feature lower offset voltage, higher supply voltage capability, lower supply current, lower input bias current, lower propagation delay, and improved 2 kV ESD performance and input ruggedness through dedicated ESD clamps. The LM339B and LM2901B can drop-in replace the LM239, LM339 and LM2901, for both "A" and "V" grades.
All devices consist of four independent voltage comparators that are designed to operate from a single power supply over a wide range of voltages.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LM339B, LM2901B, LM339, LM239, LM139, LM2901 Quad Differential Comparators datasheet (Rev. X) | PDF | HTML | 2023年 10月 26日 |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。