LM339LV-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- 1.65 V to 5.5 V supply range
- Rail-to-Rail input with Failsafe
- Low input offset voltage 400 µV typical
- 600ns typical propagation delay
- Low quiescent current 25 µA/Ch typical
- Low input bias current 5 pA typical
- Open-drain output
- Full -40°C to +125°C temperature range
- Power-On-Reset (POR) for known start-up
- 2 kV ESD protection
- Improved replacement for TL331 -Q1, LM393 -Q1 & LM339 -Q1 family for V CC ≤ 5 V.
- Alternate pinout for single (TL391 -Q1)
The LV device family consists of single, dual and quad independent voltage comparators that operate from a wide supply voltage range. The LV devices can drop-in replace the standard TL331 -Q1, LM2xx, LM3xx and LM290x -Q1 comparator family in low voltage (≤ 5 V) applications for improved performance and added features.
The LV devices include a Power-On-Reset (POR) feature to make sure the output is in a High-Z state until the minimum supply voltage has been reached to prevent output transients during power-up and power-down. The family also feature Rail to Rail inputs that can go up to 6 V without damage or phase inversion.
The LV devices are specified for the temperature range of -40°C to +125°C, which covers the ranges of the TL331 -Q1, LM2xx -Q1, LM3xx and LM290x -Q1 comparator families.
您可能會感興趣的類似產品
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TL331LV-Q1, TL391LV-Q1, LM393LV-Q1and LM339LV-Q1Low VoltageAutomotiveRail to Rail Input Comparators datasheet (Rev. E) | PDF | HTML | 2023年 11月 16日 |
Functional safety information | LM393LV-Q1 and LM339LV-Q1 Functional Safety FIT Rate, FMD and Pin FMA | 2023年 7月 10日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
SOT-23-THN (DYY) | 14 | Ultra Librarian |
TSSOP (PW) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。