LM4857
- Stereo Speaker Amplifier
- Stereo Headphone Amplifier
- Mono Earpiece Amplifier
- Mono Line Output for External Handsfree Carkit
- Independent Left, Right, and Mono Volume Controls
- TI 3D Enhancement
- I2C Compatible Interface
- Ultra low Shutdown Current
- Click and Pop Suppression Circuit
- 16 distinct Output Modes
- Thermal Shutdown Protection
- Available in DSBGA and UQFN packages
Key Specifications
- POUT, Stereo Loudspeakers, 4Ω, 5V, 1% THD+N (LM4857SP) 1.6W (typ)
- POUT, Stereo Loudspeakers, 8Ω, 5V, 1% THD+N 1.2W (typ)
- POUT, Stereo Headphones, 32Ω, 5V, 1% THD+N 75mW (typ)
- POUT, Mono Earpiece, 32Ω, 5V, 1% THD+N 100mW (typ)
- POUT, Stereo Loudspeakers, 8Ω, 3.3V, 1% THD+N 495mW (typ)
- POUT, Stereo Headphones, 32Ω, 3.3V, 1% THD+N 33mW (typ)
- POUT, Mono Earpiece, 32Ω, 3.3V, 1% THD+N 43mW (typ)
- Shutdown Current 0.06μA (typ)
All trademarks are the property of their respective owners.
The LM4857 is an integrated audio sub-system designed for stereo cell phone applications. Operating on a 3.3V supply, it combines a stereo speaker amplifier delivering 495mW per channel into an 8Ω load, a stereo headphone amplifier delivering 33mW per channel into a 32Ω load, a mono earpiece amplifier delivering 43mW into a 32Ω load, and a line output for an external powered handsfree speaker. It integrates the audio amplifiers, volume control, mixer, power management control, and TI 3D enhancement all into a single package. In addition, the LM4857 routes and mixes the stereo and mono inputs into 16 distinct output modes. The LM4857 is controlled through an I2C compatible interface. Other features include an ultra-low current shutdown mode and thermal shutdown protection.
Boomer audio power amplifiers are designed specifically to provide high quality output power with a minimal amount of external components.
The LM4857 is available in a 30-bump DSBGA package and a 28–lead UQFN package.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | LM4857 Stereo 1.2W Audio Sub-system with 3D Enhancement datasheet (Rev. I) | 2013年 4月 19日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點