LMV112
- (Typical Values are: VSUPPLY = 2.7V and
CL = 20 pF, Unless Otherwise Specified.) - Small Signal Bandwidth 40 MHz
- Supply Voltage Range 2.4V to 5V
- Slew Rate 110 V/μs
- Total Supply Current 1.6 mA
- Shutdown Current 59 µA
- Rail-to-Rail Input and Output
- Individual Buffer Enable Pins
- Rapid Ton Technology
- Crosstalk Rejection Circuitry
- 8-pin WSON, Pin Access Packaging
- Temperature Range −40°C to 85°C
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The LMV112 is a high speed dual clock buffer designed for portable communications and accurate multi-clock systems. The LMV112 integrates two 40 MHz low noise buffers which optimizes application and out performs large discrete solutions. This device enables superb system operation between the base band and the oscillator signal path while eliminating crosstalk.
Texas Instruments' unique technology and design deliver accuracy, capacitance and load resistance while increasing the drive capability of the device. The low power consumption makes the LMV112 perfect for battery applications.
The robust, independent, and flexible buffers are designed to provide the customer with the ability to manage complex clock signals in the latest wireless applications. The buffers deliver 110 V/μs internal slew rate with independent shutdown and duty cycle precision. The patented analog circuit drives capacitive loads beyond 20 pF. Texas Instruments' proven biasing technique has 1V centering, rail-to-rail input/output unity gain, and AC coupled convenient inputs. These integrated cells save space and require no external bias resistors. Texas Instruments' rapid recovery after disable optimizes performance and current consumption. The LMV112 offers individual enable pin controls and since there is no internal ground reference either single or split supply configurations offer additional system flexibility and power choices.
The LMV112 is a proven replacement for any discrete circuitry and simplifies board layout while minimizing related parasitic components.
The LMV112 is produced in the small WSON package which offers high quality while minimizing its use of PCB space. Texas Instruments' advanced packaging offers direct PCB-IC evaluation via pin access.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | LMV112 40 MHz Dual Clock Buffer datasheet (Rev. B) | 2013年 5月 2日 | |
| EVM User's guide | AN-1799 LMV112 40 MHz Dual Clock Buffer Evaluation Board (Rev. A) | 2013年 4月 30日 | ||
| Application note | Use of the LMV112 to Reduce Ref Clk Interaction in Handheld Device (Rev. A) | 2013年 4月 30日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TIDA-010057 — 超音波智慧探測器電源供應參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WSON (NGQ) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。