LMV7235
- VS = 5 V, TA = 25°C (Typical Values Unless Otherwise Specified)
- Propagation Delay: 75 ns
- Low supply Current: 65 µA
- Rail-to-Rail Input
- Open Drain and Push-Pull Output
- Ideal for 2.7-V and 5-V, Single-Supply Applications
- Available in Space-Saving Packages:
- 5-Pin SOT-23
- 5-Pin SC70
The LMV7235 and LMV7239 are ultra low power, low voltage, 75-ns comparators. They are ensured to operate over the full supply voltage range of 2.7 V to 5.5 V. These devices achieve a 75-ns propagation delay while consuming only 65 µA of supply current at 5 V.
The LMV7235 and LMV7239 have a greater than rail-to-rail common-mode voltage range. The input common mode voltage range extends 200 mV below ground and 200 mV above supply, allowing both ground and supply sensing.
The LMV7235 features an open drain output. By connecting an external resistor, the output of the comparator can be used as a level shifter.
The LMV7239 features a push-pull output stage. This feature allows operation without the need of an external pullup resistor.
The LMV7235 and LMV7239 are available in the 5-pin SC70 and 5-pin SOT-23 packages, which are ideal for systems where small size and low power is critical.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMV7235 and LMV7239 75-ns, Ultra Low Power, Low Voltage, Rail-to-Rail Input datasheet (Rev. O) | 2018年 4月 16日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。