LSF0102-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C ≤ T A ≤ 125°C
- Device HBM ESD Classification Level 2
- CDM ESD Classification Level C6
- Provides bidirectional voltage translation with no direction Pin
- Supports open drain and push-pull applications such as I 2C, SPI, UART, MDIO, SDIO, and GPIO
- Supports up to 100 MHz up translation and greater than 100 MHz down translation at ≤ 30pF cap load and up to 40 MHz up or down translation at 50 pF cap load
- Enables bidirectional voltage level translation between
- 0.95 V ↔ 1.8/2.5/3.3/5 V
- 1.2 V ↔ 1.8/2.5/3.3/5 V
- 1.8 V ↔ 2.5/3.3/5 V
- 2.5 V ↔ 3.3/5 V
- 3.3 V ↔ 5 V
- Low standby current
- 5 V tolerant I/O ports to support TTL voltage levels
- Low r on provides less signal distortion
- High-impedance I/O pins when EN = low
- Flow-through pinout for ease of PCB trace routing
- Latch-up performance exceeds 100 mA per JESD 78, Class II
The LSF0102-Q1 device is an auto bidirectional voltage translator that translates among a wide range of supplies without the need for a directional pin. The LSF0102-Q1 supports up to 100 MHz up translation and greater than 100 MHz down translation with capacitive loads ≤ 30 pF. Additionally, the LSF0102-Q1 supports up to 40 MHz up and down translation at 50 pF capacitance load, which enables the LSF0102-Q1 device to support a wide variety of standard interfaces commonly found in automotive applications such as I 2C, SPI, GPIO, SDIO, UART, and MDIO.
The LSF0102-Q1 device has 5-V tolerant data inputs. This makes the device compatible with TTL voltage levels. Furthermore, the LSF0102-Q1 supports mixed-mode voltage translation, allowing the device to up translate and down translate to different supply levels on each channel.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LSF0102-Q1 Automotive 2-Channel Auto Bidirectional Multi-Voltage Level Translator datasheet (Rev. B) | PDF | HTML | 2023年 5月 10日 |
Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024年 7月 12日 | |
Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024年 7月 3日 | |
Application brief | Integrated vs. Discrete Open Drain Level Translation | PDF | HTML | 2024年 1月 9日 | |
Product overview | Translate Voltages for I2C | PDF | HTML | 2022年 6月 2日 | |
Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021年 4月 15日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組
LSF-EVM — 1 至 8 位元 LSF 轉換器系列評估模組
The LSF family of devices are level translators that support a voltage range of 0.95V and 5V and provide multi-voltage bidirectional translation without a direction pin.
The LSF-EVM comes populated with the LSF0108PWR device and has landing patterns that are compatible with the LSF0101DRYR, (...)
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VSSOP (DCU) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點