RES11A
- Wide temperature range: –40°C to +125°C
- High ratio matching precision: ±0.05 % (maximum)
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Low drift: ±2 ppm/°C TCR (maximum)
The RES11A is a matched pair of resistive dividers, implemented in thin-film SiCr with Texas Instruments modern, high-performance, analog CMOS process. The device has a nominal input resistance of 1 kΩ, for low thermal and current noise, and is available in several nominal ratios to meet a wide array of system needs. Use the RES11A in an inverse gain configuration by simply rotating the device placement by 180°. This feature supports layout reuse and increases flexibility for applications such as discrete instrumentation or difference amplifier implementations.
The RES11A series features high ratio-matching precision, with the measured ratio of each divider within ±120 ppm (typical) of the nominal. This precision is maintained over the temperature range, with a maximum ratio drift of only ±2 ppm/°C. Additionally, the biased long-term stability of the device has been proven through thorough characterization.
The RES11A is specified with a temperature range from –40°C to +125°C. The device is offered in an 8‑pin, SOT‑23-THIN package, with a body size of 2.9 mm × 1.6 mm (body size is a nominal value and does not include pins).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | RES11A Matched, Thin-Film Resistor Dividers With 1-kΩ Inputs datasheet | PDF | HTML | 2023年 12月 15日 |
Product overview | Navigating Precision Resistor Networks | PDF | HTML | 2024年 1月 24日 | |
Application note | Optimizing CMRR in Differential Amplifier Circuits With Precision Matched Resist | PDF | HTML | 2023年 11月 3日 |
設計與開發
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SMALL-AMP-DIP-EVM — 適用於採用小尺寸封裝之運算放大器的評估模組
SMALL-AMP-DIP-EVM 提供快速簡易方式,與許多業界標準小型封裝進行介接,因而加速小型封裝運算放大器原型設計。SMALL-AMP-DIP-EVM 支援八個小型封裝選項,包括 DPW-5 (X2SON)、DSG-8 (WSON)、DCN-8 (SOT)、DDF-8 (SOT)、RUG-10 (X2QFN)、RUC-14 (X2QFN)、RGY-14 (VQFN) 和 RTE-16 (WQFN)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23-THN (DDF) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點