SN65HVD1794
- Bus-Pin Fault Protection to > ±70 V
- Cable Invert Function Allows Correction for Reversed Bus Pins
- Common-Mode Voltage Range (–20 V to 25 V) More Than Doubles TIA/EIA
485 Requirement - Bus I/O Protection
- ±16 kV JEDEC HBM Protection
- Reduced Unit Load for Up to 256 Nodes
- Failsafe Receiver for Open-Circuit, Short-Circuit and Idle-Bus Conditions
- Low Power Consumption
- ICC 5 mA Quiescent During Operation
- Power-Up, Power-Down Glitch-Free Operation
These devices are designed to survive overvoltage faults such as direct shorts to power supplies, mis-wiring faults, connector failures, cable crushes, and tool mis-applications. They are also robust to ESD events, with high levels of protection to human-body model specifications.
These devices combine a differential driver and a differential receiver, which operate from a single power supply. The driver differential outputs and the receiver differential inputs are connected internally to for a bus port suitable for half-duplex (two-wire bus) communication. A cable invert pin (INV) allows active correction of mis-wires that may occur during installation. Upon detecting communication errors, the user can apply a logic HIGH to the INV pin, effectively inverting the polarity of the differential bus port, thereby correcting for the reversed bus wires.
These devices feature a wide common-mode voltage range, making them suitable for multi-point applications over long cable runs. These devices are characterized from –40°C to 105°C.
For similar features with 3.3 V supply operation, see the SN65HVD1781 (SLLS877).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 70-V Fault-Protected RS-485 Transceivers with Cable Invert datasheet (Rev. A) | 2012年 9月 28日 | |
EVM User's guide | RS-485 Half-Duplex EVM User's Guide (Rev. C) | PDF | HTML | 2021年 9月 1日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
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SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。