SN65LVDS100
- Designed for Signaling Rates ≥ 2 Gbps
- Total Jitter < 65 ps
- Low-Power Alternative for the MC100EP16
- Low 100-ps (Maximum) Part-to-Part Skew
- 25 mV of Receiver Input Threshold Hysteresis
Over 0-V to 4-V Input Voltage Range - Inputs Electrically Compatible With LVPECL,
CML, and LVDS Signal Levels - 3.3-V Supply Operation
- LVDT Integrates 110-Ω Terminating Resistor
- Offered in SOIC and MSOP
The SN65LVDS100, SN65LVDT100, SN65LVDS101, and SN65LVDT101 are high-speed differential receivers and drivers connected as repeaters. The receiver accepts low-voltage differential signaling (LVDS), positive-emitter-coupled logic (PECL), or current-mode logic (CML) input signals at rates up to 2 Gbps and repeats it as either an LVDS or PECL output signal. The signal path through the device is differential for low radiated emissions and minimal added jitter.
The outputs of the SN65LVDS100 and SN65LVDT100 are LVDS levels as defined by TIA/EIA-644-A. The outputs of the SN65LVDS101 and SN65LVDT101 are compatible with 3.3-V PECL levels. Both drive differential transmission lines with nominally 100-Ω characteristic impedance.
The SN65LVDT100 and SN65LVDT101 include a 110-Ω differential line termination resistor for less board space, fewer components, and the shortest stub length possible. They do not include the VBB voltage reference found in the SN65LVDS100 and SN65LVDS101. VBB provides a voltage reference of typically 1.35 V below VCC for use in receiving single-ended input signals and is particularly useful with single-ended 3.3-V PECL inputs. When VBB is not used, it should be unconnected or open.
All devices are characterized for operation from –40°C to 85°C.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SN65LVDx10x Differential Translator/Repeater datasheet (Rev. E) | PDF | HTML | 2015年 7月 20日 |
| Application brief | How to Use a 3.3-V LVDS Buffer as a Low-Voltage LVDS Driver | 2019年 1月 9日 | ||
| Application note | Signaling Rate vs. Distance for Differential Buffers | 2010年 1月 26日 | ||
| Application note | AC Coupling Between Differential LVPECL, LVDS, HSTL and CML (Rev. C) | 2007年 10月 17日 | ||
| Application note | DC-Coupling Between Differential LVPECL, LVDS, HSTL, and CML | 2003年 2月 19日 | ||
| EVM User's guide | 2-GBPS Differential Repeater EVM (Rev. A) | 2002年 11月 11日 | ||
| More literature | HPL EVM Program | 2002年 8月 29日 | ||
| EVM User's guide | 2-GBPS Differential Repeater EVM | 2002年 8月 8日 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
| VSSOP (DGK) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。