SN65MLVD203B
- Compatible with the M-LVDS standard TIA/EIA-899 for multipoint data interchange
- Low-voltage differential 30-Ω to 55-Ω line driver and receiver for signaling rates(1) up to 200 Mbps, clock frequencies up to 100 MHz
- Type-1 receiver incorporates 25 mV of hysteresis
- Bus I/O protection
- ±8-kV HBM
- ±8-kV IEC 61000-4-2 contact discharge
- Controlled driver output voltage transition times for improved signal quality
- –1-V to 3.4-V common-mode voltage range allows data transfer with 2 V of ground noise
- Bus pins high impedance when disabled or VCC ≤ 1.5 V
- 100-Mbps device available (SN65MLVD202B)
- Improved alternatives to SN65MLVD203 (1)
(1)The signaling rate of a line is the number of voltage transitions that are made per second expressed in the bps of the unit (bits per second).
The SN65MLVD203B device is a multipoint low-voltage differential signaling (M-LVDS) line driver and receiver which is optimized to operate at signaling rates up to 200 Mbps. This device has a robust 3.3-V driver and receiver in the standard QFN footprint for demanding industrial applications. The bus pins are robust to ESD events, with high levels of protection to human-body model and IEC contact discharge specifications.
The device combines a differential driver and a differential receiver (transceiver), which operates from a single 3.3-V supply. The transceiver is optimized to operate at signaling rates up to 200 Mbps.
The SN65MLVD203B has enhancements over similar devices. Improved features include a controlled slew rate on the driver output to help minimize reflections from unterminated stubs, resulting in better signal integrity. The devices are characterized for operation from –40°C to 125°C.
The SN65MLVD203B M-LVDS transceiver is part of the TI extensive M-LVDS portfolio.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN65MLVD203B Full-Duplex Type-1 Multipoint-LVDS Transceiver With IEC ESD Protection datasheet (Rev. B) | PDF | HTML | 2022年 11月 2日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RUM) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。