產品詳細資料

Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 8 IOH (max) (mA) -8 Input type CMOS Output type CMOS Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Technology family AHC Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 8 IOH (max) (mA) -8 Input type CMOS Output type CMOS Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Technology family AHC Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Operating Range 2-V to 5.5-V V CC
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 1000 V Per MIL-STD-833, Method 3015; Exceeds 100 V Using Machine Model (C = 200 pF, R = 0)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Operating Range 2-V to 5.5-V V CC
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 1000 V Per MIL-STD-833, Method 3015; Exceeds 100 V Using Machine Model (C = 200 pF, R = 0)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74AHC245 octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.

This device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)\ input can be used to disable the device so that the buses effectively are isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74AHC245 octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.

This device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)\ input can be used to disable the device so that the buses effectively are isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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類型 標題 日期
* Data sheet SN74AHC245-EP datasheet (Rev. A) 2003年 5月 30日
* VID SN74AHC245-EP VID V6203650 2016年 6月 21日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note How to Select Little Logic (Rev. A) 2016年 7月 26日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004年 11月 4日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note Selecting the Right Level Translation Solution (Rev. A) 2004年 6月 22日
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 2002年 12月 2日
Application note Texas Instruments Little Logic Application Report 2002年 11月 1日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 2000年 2月 24日
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999年 9月 8日
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 1998年 4月 1日
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997年 12月 1日
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Live Insertion 1996年 10月 1日

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SOIC (DW) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian

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