SN74ALS760
- Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers
- Eliminates the Need for 3-State Overlap Protection
- pnp Inputs Reduce dc Loading
- Open-Collector Versions of ´ALS244 and ´AS244
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs
These octal buffers and line drivers are designed specifically to
improve both the performance and density of 3-state memory address
drivers, clock drivers, and bus-oriented receivers and transmitters
by eliminating the need for 3-state overlap protection. With the
´AS756 and SN74AS757, these devices provide the choice of
selected combinations of inverting outputs, symmetrical active-low
output-enable (
) inputs, and
complementary OE and
inputs.
The SN54AS760 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS760 and SN74AS760 are characterized for operation from 0°C to 70°C.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Octal Buffers & Line Drivers With Open-Collector Outputs datasheet (Rev. A) | 1995年 1月 1日 | |
| Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997年 8月 1日 | ||
| Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||
| Application note | Live Insertion | 1996年 10月 1日 | ||
| Application note | Advanced Schottky (ALS and AS) Logic Families | 1995年 8月 1日 |
設計與開發
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14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| PDIP (N) | 20 | Ultra Librarian |
| SOIC (DW) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點