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SN74ALVTH16827

停產

具有匯流排電位保持、TTL 相容 CMOS 輸入和 3 態輸出的 20 通道、2.3-V 至 3.6-V 緩衝器

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產品規格表
SN74ALVTH16827 已停止生產
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引腳對引腳且具備與所比較裝置相同的功能
SN74ALVCH16827 現行 具匯流排電位保持和 3 態輸出的 20 通道、1.65-V 至 3.6-V 緩衝器 Replacement

SN74ALVTH16827

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產品規格表 立即訂購

產品詳細資料

Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 20 IOL (max) (mA) 64 Supply current (max) (µA) 6000 IOH (max) (mA) -64 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 20 IOL (max) (mA) 64 Supply current (max) (µA) 6000 IOH (max) (mA) -64 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TVSOP (DGV) 56 72.32 mm² 11.3 x 6.4
  • State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive (-24/24 mA at 2.5-V and -32/64 mA at 3.3-V VCC)
  • Power Off Disables Outputs, Permitting Live Insertion
  • High-Impedance State During Power Up and Power Down Prevents Driver Conflict
  • Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

    Widebus is a trademark of Texas Instruments Incorporated.
  • State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive (-24/24 mA at 2.5-V and -32/64 mA at 3.3-V VCC)
  • Power Off Disables Outputs, Permitting Live Insertion
  • High-Impedance State During Power Up and Power Down Prevents Driver Conflict
  • Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

    Widebus is a trademark of Texas Instruments Incorporated.

The 'ALVTH16827 devices are 20-bit buffers/line drivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices are composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1\ and 1OE2\, or 2OE1\ and 2OE2\) inputs must be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ALVTH16827 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16827 is characterized for operation from -40°C to 85°C.

The 'ALVTH16827 devices are 20-bit buffers/line drivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices are composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1\ and 1OE2\, or 2OE1\ and 2OE2\) inputs must be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ALVTH16827 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16827 is characterized for operation from -40°C to 85°C.

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類型 標題 日期
* Data sheet 2.5-V/3.3-V 20-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. E) 1998年 12月 18日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點