SN74AUP1G08-Q1
- AEC-Q100 Qualified with the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C3B
- Available in the Texas Instruments NanoStar Package
- Low Static-Power Consumption:
ICC = 0.9 µA Max - Low Dynamic-Power Consumption:
Cpd = 4.3 pF Typ at 3.3 V - Low Input Capacitance: Ci = 1.5 pF Typ
- Low Noise: Overshoot and Undershoot
< 10% of VCC - Ioff Supports Partial-Power-Down Mode Operation
- Schmitt-Trigger Action Allows Slow Input Transition and Better
Switching Noise Immunity at the Input (Vhys = 250 mV, Typ at
3.3 V) - Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V Input/Output (I/O) Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.3 ns Max at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD-78, Class II
NanoStar is a trademark of Texas Instruments.
The AUP family is TI’s premier solution to the low-power needs of the industry in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
This single 2-input positive-AND gate performs the Boolean function: Y = A • B or Y = A\ + B\ in positive logic.
NanoStar package technology is a major breakthrough in integrated circuit (IC) packaging concepts, because it uses the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-SC70 (DCK) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點