SN74BCT652
- State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
- ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Independent Registers and Enables for A and B Buses
- Multiplexed Real-Time and Stored Data
- Power-Up High-Impedance Mode
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)
These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers.
Output-enable (OEAB and )
inputs are provided to control the transceiver functions.
Select-control (SAB and SBA) inputs are provided to select whether
real-time or stored data is transferred. The circuitry used for
select control eliminates the typical decoding glitch that occurs in
a multiplexer during the transition between stored and real-time
data. A low input selects real-time data, and a high input selects
stored data. Figure 1 illustrates the four fundamental bus-management
functions that can be performed with the ´BCT652.
Data on the A or B data bus, or both, can be stored in the
internal D-type flip-flops by low-to-high transitions at the
appropriate clock (CLKAB or CLKBA) inputs regardless of the select-
or enable-control pins. When SAB and SBA are in the real-time
transfer mode, it is possible to store data without using the
internal D-type flip-flops by simultaneously enabling OEAB and . In this configuration each output
reinforces its input. Therefore, when all other data sources to the
two sets of bus lines are at high impedance, each set of bus lines
remain at its last state.
The SN54BCT652 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT652 is characterized for operation from 0°C to 70°C.
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- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點