SN74LVC2G06-Q1
- Qualified for Automotive Applications
- Supports 5-V VCC Operation
- Max tpd of 3.4 ns at 3.3 V
- Low Power Consumption, 10-µA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C - Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
This dual inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC2G06-Q1 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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開發板
5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組
靈活的 EVM 旨在支援任何針腳數為 5 至 8 支且採用 DCK、DCT、DCU、DRL 或 DBV 封裝的裝置。
使用指南: PDF
參考設計
TIDA-01428 — 採用 CAN 離散式 SBC 的車用預降壓、後升壓參考設計
The TIDA-01428 reference design implements a 1-A, wide-VIN, buck converter to 3.3 V followed by a compact, low-input voltage, fixed 5-V boost converter for powering a controller area network (CAN) physical layer interface. The design has been tested for CISPR 25 radiated emissions and conducted (...)
參考設計
TIDA-01429 — 採用 CAN 的車用離散式 SBC 預升壓、後降壓參考設計
The TIDA-01429 reference design implements a wideinput voltage boost controller, followed by a wide input voltage buck converter set to 5.0 V. The 5.0 V supply is used for powering a Controller Area Network (CAN) transceiver and a compact fixed 3.3 V linear drop-out (LDO) regulator for supplying (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-SC70 (DCK) | 6 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點