產品詳細資料

Supply voltage (min) (V) 3.15 Supply voltage (max) (V) 3.45 Number of channels 10 IOL (max) (mA) 12 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Bias Vcc, Bus-hold, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Very high speed (tpd 5-10ns) Technology family VME Rating Catalog Operating temperature range (°C) 0 to 85
Supply voltage (min) (V) 3.15 Supply voltage (max) (V) 3.45 Number of channels 10 IOL (max) (mA) 12 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Bias Vcc, Bus-hold, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Very high speed (tpd 5-10ns) Technology family VME Rating Catalog Operating temperature range (°C) 0 to 85
TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Member of the Texas Instruments Widebus™ Family
  • UBT™ Transceiver Combines D-Type Latches and D-Type Flip-Flops
    for Operation in Transparent, Latched, or Clocked Modes
  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic
    Interference (EMI)
  • Compliant With VME64, 2eVME, and 2eSST Protocol
  • Bus Transceiver Split LVTTL Port Provides a Feedback Path for Control
    and Diagnostics Monitoring
  • I/O Interfaces Are 5-V Tolerant
  • B-Port Outputs (–48 mA/64 mA)
  • Y and A-Port Outputs (–12 mA/12 mA)
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Bus Hold on 3A-Port Data Inputs
  • 26- Equivalent Series Resistor on 3A Ports and Y Outputs
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

MicroStar is a trademark of Texas Instruments.
(1) VME320 is a patented backplane construction by Arizona Digital, Inc.

  • Member of the Texas Instruments Widebus™ Family
  • UBT™ Transceiver Combines D-Type Latches and D-Type Flip-Flops
    for Operation in Transparent, Latched, or Clocked Modes
  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic
    Interference (EMI)
  • Compliant With VME64, 2eVME, and 2eSST Protocol
  • Bus Transceiver Split LVTTL Port Provides a Feedback Path for Control
    and Diagnostics Monitoring
  • I/O Interfaces Are 5-V Tolerant
  • B-Port Outputs (–48 mA/64 mA)
  • Y and A-Port Outputs (–12 mA/12 mA)
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Bus Hold on 3A-Port Data Inputs
  • 26- Equivalent Series Resistor on 3A Ports and Y Outputs
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

MicroStar is a trademark of Texas Instruments.
(1) VME320 is a patented backplane construction by Arizona Digital, Inc.

The SN74VMEH22501 8-bit universal bus transceiver has two integral 1-bit three-wire bus transceivers and is designed for 3.3-V VCC operation with 5-V tolerant inputs. The UBT™ transceiver allows transparent, latched, and flip-flop modes of data transfer, and the separate LVTTL input and outputs on the bus transceivers provide a feedback path for control and diagnostics monitoring. This device provides a high-speed interface between cards operating at LVTTL logic levels and VME64, VME64x, or VME320(1) backplane topologies.

High-speed backplane operation is a direct result of the improved OEC™ circuitry and high drive that has been designed and tested into the VME64x backplane model. The B-port I/Os are optimized for driving large capacitive loads and include pseudo-ETL input thresholds (½ VCC ± 50 mV) for increased noise immunity. These specifications support the 2eVME protocols in VME64x (ANSI/VITA 1.1) and 2eSST protocols in VITA 1.5. With proper design of a 21-slot VME system, a designer can achieve 320-Mbyte transfer rates on linear backplanes and, possibly, 1-Gbyte transfer rates on the VME320 backplane.

All inputs and outputs are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs.

Active bus-hold circuitry holds unused or undriven 3A-port inputs at a valid logic state. Bus-hold circuitry is not provided on 1A or 2A inputs, any B-port input, or any control input. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry prevents damaging current to backflow through the device when it is powered off/on. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, output-enable (OE and OEBY) inputs should be tied to VCC through a pullup resistor and output-enable (OEAB) inputs should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the drive capability of the device connected to this input.

The SN74VMEH22501 8-bit universal bus transceiver has two integral 1-bit three-wire bus transceivers and is designed for 3.3-V VCC operation with 5-V tolerant inputs. The UBT™ transceiver allows transparent, latched, and flip-flop modes of data transfer, and the separate LVTTL input and outputs on the bus transceivers provide a feedback path for control and diagnostics monitoring. This device provides a high-speed interface between cards operating at LVTTL logic levels and VME64, VME64x, or VME320(1) backplane topologies.

High-speed backplane operation is a direct result of the improved OEC™ circuitry and high drive that has been designed and tested into the VME64x backplane model. The B-port I/Os are optimized for driving large capacitive loads and include pseudo-ETL input thresholds (½ VCC ± 50 mV) for increased noise immunity. These specifications support the 2eVME protocols in VME64x (ANSI/VITA 1.1) and 2eSST protocols in VITA 1.5. With proper design of a 21-slot VME system, a designer can achieve 320-Mbyte transfer rates on linear backplanes and, possibly, 1-Gbyte transfer rates on the VME320 backplane.

All inputs and outputs are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs.

Active bus-hold circuitry holds unused or undriven 3A-port inputs at a valid logic state. Bus-hold circuitry is not provided on 1A or 2A inputs, any B-port input, or any control input. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry prevents damaging current to backflow through the device when it is powered off/on. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, output-enable (OE and OEBY) inputs should be tied to VCC through a pullup resistor and output-enable (OEAB) inputs should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the drive capability of the device connected to this input.

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類型 標題 日期
* Data sheet SN74VMEH22501 datasheet (Rev. F) 2010年 2月 23日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note SN74VMEH22501 Universal Bus Transceiver for the VMEbus Backplane 2003年 5月 14日
More literature SN74VMEH22501 Application Clip 2003年 3月 4日
Application note VMEH22501 in 2eSST and Conventional VME Backplane Applications 2002年 10月 7日
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日

設計與開發

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模擬型號

HSPICE Model of SN74VMEH22501

SCEJ139.ZIP (59 KB) - HSpice Model
模擬型號

SN74VMEH22501 IBIS Model (Rev. A)

SCEM229A.ZIP (55 KB) - IBIS Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (DGG) 48 Ultra Librarian
TVSOP (DGV) 48 Ultra Librarian

訂購與品質

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  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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