TLC5922
- 16 Channels
- Drive Capability
- 0 to 80 mA (Constant-Current Sink)
- Constant Current Accuracy
- ±1% (typical)
- Serial Data Interface, SPI Compatible
- Fast Switching Output: Tr / Tf = 10ns (typical)
- CMOS Level Input/Output
- 30 MHz Data Transfer Rate
- VCC = 3.0 V to 5.5 V
- Operating Temperature = –20°C to 85 °C
- LED Supply Voltage up to 17 V
- 32-pin HTSSOP (PowerPAD) Package
- Dot Correction
- 7 bit (128 Steps)
- Individually Adjustable For Each Channel
- Controlled In-Rush Current
- APPLICATIONS
- Monocolor, Multicolor, Fullcolor LED Display
- Monocolor, Multicolor LED Signboard
- Display Backlighting
- Multicolor LED Lighting Applications
PowerPAD is a trademark of Texas Instruments.
The TLC5922 is a 16-channel constant-current sink driver. Each channel has an On/Off state and a 128-step adjustable constant-current sink (dot correction). The dot correction adjusts the brightness variations between LED, LED channels, and other LED drivers. Both dot correction and On/Off state are accessible via a serial data interface. A single external resistor sets the maximum current of all 16 channels.
技術文件
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檢視所有 4 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LED Driver- TLC5922 datasheet (Rev. B) | 2009年 10月 26日 | |
White paper | Common LED Functions and LED Driver Design Considerations | 2020年 9月 21日 | ||
Selection guide | Power Management Guide 2018 (Rev. R) | 2018年 6月 25日 | ||
Application note | LED Driver--Paralleled Outputs Provide High Current Outputs | 2006年 9月 25日 |
設計與開發
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模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (DAP) | 32 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。