TLV1704
- Supply Range:
+2.2 V to +36 V or ±1.1 V to ±18 V - Low Quiescent Current:
55 µA per Comparator - Input Common-Mode Range Includes Both Rails
- Low Propagation Delay: 560 ns
- Low Input Offset Voltage: 300 µV
- Open Collector Outputs
- Up To 36 V Above Negative Supply Regardless of Supply Voltage
- Industrial Temperature Range:
–40°C to +125°C - Small Packages:
- Single: SC70-5, SOT-23-5, SOT553-5
- Dual: VSSOP-8, X2QFN-8
- Quad: TSSOP-14
The TLV170x family of devices offers a wide supply range, rail-to-rail inputs, low quiescent current, and low propagation delay. All these features come in industry-standard, extremely-small packages, making these devices the best general-purpose comparators available.
The open collector output offers the advantage of allowing the output to be pulled to any voltage rail up to +36 V above the negative power supply, regardless of the TLV170x supply voltage.
These devices are available in single (TLV1701), dual (TLV1702), and quad (TLV1704) channel versions. Low input offset voltage, low input bias currents, low supply current, and open-collector configuration make the TLV170x family flexible enough to handle almost any application, from simple voltage detection to driving a single relay.
All devices are specified for operation across the expanded industrial temperature range of –40°C to +125°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV170x 2.2-V to 36-V, microPower Comparator datasheet (Rev. D) | PDF | HTML | 2015年 6月 9日 |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
TLV170x and TLV170x-Q1 TINA-TI Reference Design and Macromodel (Rev. A)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。