現在提供此產品的更新版本
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
TLV2374-EP
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree
- Rail-To-Rail Input/Output
- Wide Bandwidth . . . 3 MHz
- High Slew Rate . . . 2.4 V/µs
- Supply Voltage Range . . . 2.7 V to 16 V
- Supply Current . . . 550 µA/Channel
- Input Noise Voltage . . . 39 nV/Hz\
- Input Bias Current . . . 1 pA
- Specified Temperature Range
- -55°C to 125°C
- Ultrasmall Packaging
- 5 Pin SOT-23 (TLV2371)
- 8 Pin MSOP (TLV2372)
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
The TLV237x single supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x takes the minimum operating supply voltage down to 2.7 V over the extended automotive temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only 550 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8 V supplies down to ±1.35 V) a variety of rechargeable cells.
The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products available from Texas Instruments and it is the first to allow operation up to 16-V rails with good ac performance.
The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power microcontrollers available today including Texas Instruments MSP430.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Family of 550-microampere A/Ch 3-MHz Rail-to-Rail Input/Output Op Amps datasheet (Rev. A) | 2006年 4月 5日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點