TLV3202-Q1
- Qualified for Automotive Applications
- AEC Q100-Qualified With the Following Results
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
- Device HBM ESD Classification Level 2 (TLV3201-Q1)
- Device HBM ESD Classification Level 3A (TLV3202-Q1)
- Device CDM ESD Classification Level C5
- Low Propagation Delay: 40 ns
- Low Quiescent Current:
40 µA per Channel - Input Common-Mode Range Extends 200 mV Beyond Either Rail
- Low Input Offset Voltage: 1 mV
- Push-Pull Outputs
- Supply Range: 2.7 V to 5.5 V
- Small Packages:
5-Pin SC70 and 8-Pin VSSOP
The TLV3201-Q1 and TLV3202-Q1 are single and dual-channel comparators that offer the ultimate combination of high speed (40 ns) and low-power consumption (40 µA), both in extremely small packages with features such as rail-to-rail input, low offset voltage (1 mV), and large output drive current. The devices are also very easy to implement in a wide variety of applications where response time is critical.
The TLV320x-Q1 family is available in single (TLV3201-Q1) and dual (TLV3202-Q1) channel versions, both with push-pull outputs. The TLV3201-Q1 is available in the 5-pin SC70 package. The TLV3202-Q1 is available in the 8-pin VSSOP package. All devices are specified for operation across the expanded industrial temperature range of –40°C to +125°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV320x-Q1 40-ns, Micropower, Push-Pull Output Automotive Comparators datasheet (Rev. A) | PDF | HTML | 2017年 12月 21日 |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
CIRCUIT060035 — 具有窗型比較器電路的雙向電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VSSOP (DGK) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。