TLV7032-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- Wide supply voltage range of 1.6 V to 6.5 V
- Quiescent supply current of 315 nA
- Low propagation delay of 3 µs
- Internal hysteresis of 6.5 mV
- Rail-to-rail common-mode input voltage
- Internal Power-On-Reset provides a known startup condition
- No phase reversal for overdriven inputs
- Push-pull output (TLV703x-Q1)
- Open-drain output (TLV704x-Q1)
- –40°C to 125°C Operating temperature
- Functional Safety Capable
The TLV703x-Q1/TLV704x-Q1 are low-voltage, nanopower comparators with rail-to-rail inputs. These comparators are applicable for space-critical and power conscious designs like infotainment, telematics, and head unit applications.
The TLV703x-Q1 and TLV704x-Q1 offer an excellent combination of power and speed. The benefit of fast response time at nanopower enables power-conscious systems to monitor and respond quickly to fault conditions. With an operating voltage range of 1.6 V to 6.5 V, these comparators are compatible with 1.8 V, 3 V, and 5 V systems.
The TLV703x-Q1 and TLV704x-Q1 also ensure no output phase inversion with overdriven inputs and internal hysteresis, so engineers can use this family of comparators for precision voltage monitoring in harsh, noisy environments where slow-moving input signals must be converted into clean digital outputs.
The TLV703x-Q1 have a push-pull output stage capable of sinking and sourcing milliamps of current. The TLV704x-Q1 have an open-drain output stage that can be pulled beyond VCC.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV703x-Q1 and TLV704x-Q1 Rail-to-Rail, Low-Power Comparators datasheet (Rev. D) | PDF | HTML | 2023年 2月 3日 |
Functional safety information | TLV703x-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 2021年 9月 17日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23-THN (DDF) | 8 | Ultra Librarian |
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。